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Silicon oxide nanoimprint stamp fabrication by edge lithography reinforced with silicon nitride

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Abstract

The fabrication of silicon oxide nanoimprint stamp employing edge lithography in combination with silicon nitride deposition is presented. The fabrication process is based on conventional photolithography an weg etching methods. Nanoridges with width dimension of sub-20 nm were fabricated by edge lithography. Additional silicon rich nitride layer was deposited over the original silicon dioxide nanoridges to improve the ridge stiffness and to achieve a positive tapered shape which is friendly to rich mitride shield was obtained by imprint in PMMA.
Original languageUndefined
Pages253-256
Number of pages4
Publication statusPublished - 16 Sept 2007
Event18th MicroMechanics Europe Workshop, MME 2007 - Guimaraes, Portugal
Duration: 16 Sept 200718 Sept 2007
Conference number: 18

Workshop

Workshop18th MicroMechanics Europe Workshop, MME 2007
Abbreviated titleMME
Country/TerritoryPortugal
CityGuimaraes
Period16/09/0718/09/07

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • IR-76221
  • EWI-19722

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