Simulating the induction heating of cross-ply C/PEKK laminates–sensitivity and effect of material variability

Wouter J.B. Grouve*, Francisco Sacchetti, Evan J. Vruggink, Remko Akkerman

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

11 Citations (Scopus)
243 Downloads (Pure)

Abstract

A simulation model for the induction heating of UD tape-based thermoplastic composites is presented in this work. The model is based on the electrical ply properties which were determined experimentally for two commercially available carbon reinforced tape materials. Moreover, the interrelation between the measured electrical conductivities and the fiber distribution in the tape and laminates is discussed based on microscopic structure evaluation. The model was validated experimentally for the induction heating of cross-ply laminates. Subsequently, the effect of the experimental variability in the measured conductivities on the heating behavior was investigated using the simulation model. It was found that the material variability can have a significant effect on the heating behavior.

Original languageEnglish
Pages (from-to)409-430
Number of pages22
JournalAdvanced composite materials
Volume30
Issue number5
Early online date7 Jul 2020
DOIs
Publication statusPublished - Oct 2021

Keywords

  • Electrical conductivity
  • Experiments
  • Induction heating
  • Modeling
  • Thermoplastic composites (TPCs)
  • UT-Hybrid-D

Fingerprint

Dive into the research topics of 'Simulating the induction heating of cross-ply C/PEKK laminates–sensitivity and effect of material variability'. Together they form a unique fingerprint.

Cite this