TY - JOUR
T1 - Solid-state thermal control devices
AU - Swoboda, Timm
AU - Klinar, Katja
AU - Yalamarthy, Ananth
AU - Kitanovski, Andrej
AU - Muñoz Rojo, Miguel
N1 - Wiley deal
Funding Information:
The authors acknowledge the financial support of the Slovenian Research Agency for the projects Electrocaloric devices for active cooling of electronic circuits J2‐1738 and Multicaloric Cooling J2‐9253 and the research core funding no. P2‐0223. The authors also acknowledge the financial support of the Decision Strategic Collaboration Grants (University of Twente and University of Münster 2019‐2020 ‐Ref. CvB UIT‐4395).
Publisher Copyright:
© 2020 The Authors. Advanced Electronic Materials published by Wiley-VCH GmbH
PY - 2021/3/1
Y1 - 2021/3/1
N2 - Over the past decade, solid‐state thermal control devices have emerged as potential candidates for enhanced thermal management and storage. They distinguish themselves from traditional passive thermal management devices in that their thermal properties have sharp, nonlinear dependencies on direction and operating temperature, and can lead to more efficient circuits and energy conversion systems than what is possible today. They also distinguish themselves from traditional active thermal management devices (e.g., fans) in that they have no moving parts and are compact and reliable. In this article, the recent progress in the four broad categories of solid‐state thermal control devices that are under active research is reviewed: diodes, switches, regulators, and transistors. For each class of device, the operation principle, material choices, as well as metrics to compare and contrast performance are discussed. New architectures that are explored theoretically, but not experimentally demonstrated, are also discussed.
AB - Over the past decade, solid‐state thermal control devices have emerged as potential candidates for enhanced thermal management and storage. They distinguish themselves from traditional passive thermal management devices in that their thermal properties have sharp, nonlinear dependencies on direction and operating temperature, and can lead to more efficient circuits and energy conversion systems than what is possible today. They also distinguish themselves from traditional active thermal management devices (e.g., fans) in that they have no moving parts and are compact and reliable. In this article, the recent progress in the four broad categories of solid‐state thermal control devices that are under active research is reviewed: diodes, switches, regulators, and transistors. For each class of device, the operation principle, material choices, as well as metrics to compare and contrast performance are discussed. New architectures that are explored theoretically, but not experimentally demonstrated, are also discussed.
KW - UT-Hybrid-D
KW - Thermal diodes
KW - Thermal regulators
KW - Thermal control devices
KW - Thermal transistors
KW - Thermal switches
UR - http://www.scopus.com/inward/record.url?scp=85096837100&partnerID=8YFLogxK
U2 - 10.1002/aelm.202000625
DO - 10.1002/aelm.202000625
M3 - Review article
SN - 2199-160X
VL - 7
JO - Advanced electronic materials
JF - Advanced electronic materials
IS - 3
M1 - 2000625
ER -