State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes

R.B.R. van Silfhout; A. de Boer; H.J.M. Geijselaers; Y. Li; J. Bisschop; F. Kuper; R.L. Schravendeel; J.H.J. Janssen; W.D. van Driel; G.Q. Zhang; M. Jansen

State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes

R.B.R. van Silfhout, A. de Boer, H.J.M. Geijselaers, Y. Li, J. Bisschop, F. Kuper, R.L. Schravendeel, J.H.J. Janssen, W.D. van Driel, G.Q. Zhang, M. Jansen

Applied Mechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001)
Subtitle of host publication	9-11 April 2001, Maison de la Chimie, Paris, France
Editors	Q.Q. Zhang
Place of Publication	Paris
Publisher	Europia Productions
Pages	277-289
ISBN (Print)	0-7803-9806-8, 0-7803-9807-6 (CD)
Publication status	Published - 9 Apr 2001
Event	International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EurosimE 2001 - Paris, France Duration: 9 Apr 2001 → 11 Apr 2001

Conference

Conference	International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EurosimE 2001
Country/Territory	France
City	Paris
Period	9/04/01 → 11/04/01

Cite this

van Silfhout, R. B. R., de Boer, A., Geijselaers, H. J. M., Li, Y., Bisschop, J., Kuper, F., Schravendeel, R. L., Janssen, J. H. J., van Driel, W. D., Zhang, G. Q., & Jansen, M. (2001). State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes. In Q. Q. Zhang (Ed.), Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001): 9-11 April 2001, Maison de la Chimie, Paris, France (pp. 277-289). Europia Productions.

van Silfhout, R.B.R. ; de Boer, A. ; Geijselaers, H.J.M. et al. / State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes. Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001): 9-11 April 2001, Maison de la Chimie, Paris, France. editor / Q.Q. Zhang. Paris : Europia Productions, 2001. pp. 277-289

@inproceedings{541f74009dd44acdb209eeeb03c9b190,

title = "State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes",

author = "{van Silfhout}, R.B.R. and {de Boer}, A. and H.J.M. Geijselaers and Y. Li and J. Bisschop and F. Kuper and R.L. Schravendeel and J.H.J. Janssen and {van Driel}, W.D. and G.Q. Zhang and M. Jansen",

year = "2001",

month = apr,

day = "9",

language = "English",

isbn = "0-7803-9806-8",

pages = "277--289",

editor = "Q.Q. Zhang",

booktitle = "Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001)",

publisher = "Europia Productions",

address = "France",

note = "International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EurosimE 2001 ; Conference date: 09-04-2001 Through 11-04-2001",

}

van Silfhout, RBR, de Boer, A, Geijselaers, HJM, Li, Y, Bisschop, J, Kuper, F, Schravendeel, RL, Janssen, JHJ, van Driel, WD, Zhang, GQ & Jansen, M 2001, State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes. in QQ Zhang (ed.), Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001): 9-11 April 2001, Maison de la Chimie, Paris, France. Europia Productions, Paris, pp. 277-289, International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EurosimE 2001, Paris, France, 9/04/01.

State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes. / van Silfhout, R.B.R.; de Boer, A.; Geijselaers, H.J.M. et al.
Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001): 9-11 April 2001, Maison de la Chimie, Paris, France. ed. / Q.Q. Zhang. Paris: Europia Productions, 2001. p. 277-289.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes

AU - van Silfhout, R.B.R.

AU - de Boer, A.

AU - Geijselaers, H.J.M.

AU - Li, Y.

AU - Bisschop, J.

AU - Kuper, F.

AU - Schravendeel, R.L.

AU - Janssen, J.H.J.

AU - van Driel, W.D.

AU - Zhang, G.Q.

AU - Jansen, M.

PY - 2001/4/9

Y1 - 2001/4/9

M3 - Conference contribution

SN - 0-7803-9806-8

SN - 0-7803-9807-6 (CD)

SP - 277

EP - 289

BT - Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001)

A2 - Zhang, Q.Q.

PB - Europia Productions

CY - Paris

T2 - International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EurosimE 2001

Y2 - 9 April 2001 through 11 April 2001

ER -

van Silfhout RBR, de Boer A, Geijselaers HJM, Li Y, Bisschop J, Kuper F et al. State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes. In Zhang QQ, editor, Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE 2001): 9-11 April 2001, Maison de la Chimie, Paris, France. Paris: Europia Productions. 2001. p. 277-289