Abstract
Topological insulator (Bi0.06Sb0.94)2Te3 thin films grown by molecular beam epitaxy have been capped in-situ with a 2 nm Al film to conserve the pristine topological surface states. Subsequently, a shadow mask - structured by means of focus ion beam - was in-situ placed underneath the sample to deposit a thick layer of Al on well-defined microscopically small areas. The 2 nm thin Al layer fully oxidizes after exposure to air and in this way protects the TI surface from degradation. The thick Al layer remains metallic underneath a 3–4 nm thick native oxide layer and therefore serves as (super-) conducting contacts. Superconductor-Topological Insulator-Superconductor junctions with lateral dimensions in the nm range have then been fabricated via an alternative stencil lithography technique. Despite the in-situ deposition, transport measurements and transmission electron microscope analysis indicate a low transparency, due to an intermixed region at the interface between topological insulator thin film and metallic Al.
Original language | English |
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Pages (from-to) | 183-187 |
Number of pages | 5 |
Journal | Journal of crystal growth |
Volume | 477 |
DOIs | |
Publication status | Published - 1 Nov 2017 |
Keywords
- Shadow mask
- Stencil lithography
- Molecular beam epitaxy (MBE)
- Superconductor
- Topological insulator
- Josephson junction
- 22/4 OA procedure