Stress-aware module placement on reconfigurable devices

Josef Angermeier; Daniel Ziener; Michael Glaß; Jürgen Teich

doi:10.1109/FPL.2011.56

Stress-aware module placement on reconfigurable devices

Josef Angermeier^*, Daniel Ziener, Michael Glaß, Jürgen Teich

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

18 Citations (Scopus)

Abstract

A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices.

Original language	English
Title of host publication	21st International Conference on Field Programmable Logic and Applications, FPL 2011
Pages	277-281
Number of pages	5
DOIs	https://doi.org/10.1109/FPL.2011.56
Publication status	Published - 2011
Externally published	Yes
Event	21st International Conference on Field Programmable Logic and Applications, FPL 2011 - Chania, Greece Duration: 5 Sept 2011 → 7 Sept 2011 Conference number: 21

Conference

Conference	21st International Conference on Field Programmable Logic and Applications, FPL 2011
Abbreviated title	FPL 2011
Country/Territory	Greece
City	Chania
Period	5/09/11 → 7/09/11

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10.1109/FPL.2011.56

Cite this

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title = "Stress-aware module placement on reconfigurable devices",

abstract = "A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices.",

author = "Josef Angermeier and Daniel Ziener and Michael Gla{\ss} and J{\"u}rgen Teich",

year = "2011",

doi = "10.1109/FPL.2011.56",

language = "English",

isbn = "9780769545295",

pages = "277--281",

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note = "21st International Conference on Field Programmable Logic and Applications, FPL 2011, FPL 2011 ; Conference date: 05-09-2011 Through 07-09-2011",

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T1 - Stress-aware module placement on reconfigurable devices

AU - Angermeier, Josef

AU - Ziener, Daniel

AU - Glaß, Michael

AU - Teich, Jürgen

N1 - Conference code: 21

PY - 2011

Y1 - 2011

N2 - A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices.

AB - A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices.

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U2 - 10.1109/FPL.2011.56

DO - 10.1109/FPL.2011.56

M3 - Conference contribution

AN - SCOPUS:80455127100

SN - 9780769545295

SP - 277

EP - 281

BT - 21st International Conference on Field Programmable Logic and Applications, FPL 2011

T2 - 21st International Conference on Field Programmable Logic and Applications, FPL 2011

Y2 - 5 September 2011 through 7 September 2011

ER -

Stress-aware module placement on reconfigurable devices

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