Stress-aware module placement on reconfigurable devices

Josef Angermeier*, Daniel Ziener, Michael Glaß, Jürgen Teich

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

17 Citations (Scopus)

Abstract

A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices.

Original languageEnglish
Title of host publication21st International Conference on Field Programmable Logic and Applications, FPL 2011
Pages277-281
Number of pages5
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event21st International Conference on Field Programmable Logic and Applications, FPL 2011 - Chania, Greece
Duration: 5 Sep 20117 Sep 2011
Conference number: 21

Conference

Conference21st International Conference on Field Programmable Logic and Applications, FPL 2011
Abbreviated titleFPL 2011
CountryGreece
CityChania
Period5/09/117/09/11

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