Stress-Strain Distribution Analysis in Bi2212 Subcable Based on Numerical Modeling and Experiment

J. Qin, C. Dai, Q Wang, P. Liu, B. Liu, C. Li, Q. Hao, Chao Zhou

Research output: Contribution to journalArticleAcademicpeer-review

6 Citations (Scopus)
3 Downloads (Pure)

Fingerprint

Dive into the research topics of 'Stress-Strain Distribution Analysis in Bi2212 Subcable Based on Numerical Modeling and Experiment'. Together they form a unique fingerprint.

Material Science

Engineering

Physics