Study of laser die release by Q-switched Nd:YAG laser pulses

N. Karlitskaya, D.F. de Lange, J. Meijer, Rene Sanders

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

16 Citations (Scopus)


A new laser-assisted process called "Laser Die Transfer" is developed for high speed assembling of miniature electronic components. Silicon dies, fabricated on an optically transparent carrier are released using a laser pulse. This process has the potential to offer major advantages compared to existing transfer processes for future needs: high manufacturing speeds, contact-free, ability to handle very small and thin components. In this paper we present a thermal model, which describes the nonlinear behavior of silicon and carrier material under the influence of 1064 nm laser irradiation. The threshold intensities for die release and silicon damage will be explored as a function of operating laser beam characteristics. Experimental verification is presented to compare the simulated predictions and experimental results for the die release process.
Original languageEnglish
Title of host publicationHigh-Power Laser Ablation V
EditorsClaude R. Phipps
Place of PublicationBellingham, WA, USA
Number of pages9
ISBN (Print)0-8194-5371-4
Publication statusPublished - 25 Apr 2004
EventHigh-power laser ablation V - Taos, NM, USA
Duration: 25 Apr 200430 Apr 2004

Publication series

NameProceedings of SPIE
ISSN (Print)0277-786X


ConferenceHigh-power laser ablation V
Other25-30 April 2004


  • METIS-220901
  • IR-96140


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