A new laser-assisted process called "Laser Die Transfer" is developed for high speed assembling of miniature electronic components. Silicon dies, fabricated on an optically transparent carrier are released using a laser pulse. This process has the potential to offer major advantages compared to existing transfer processes for future needs: high manufacturing speeds, contact-free, ability to handle very small and thin components. In this paper we present a thermal model, which describes the nonlinear behavior of silicon and carrier material under the influence of 1064 nm laser irradiation. The threshold intensities for die release and silicon damage will be explored as a function of operating laser beam characteristics. Experimental verification is presented to compare the simulated predictions and experimental results for the die release process.
|Title of host publication||High-Power Laser Ablation V|
|Editors||Claude R. Phipps|
|Place of Publication||Bellingham, WA, USA|
|Number of pages||9|
|Publication status||Published - 25 Apr 2004|
|Name||Proceedings of SPIE|