Surface melting of copper by ultrashort laser pulses

J. Vincenc Oboňa, V. Ocelík, J.Th.M De Hosson, J.Z.P. Skolski, V.S. Mitko, G.R.B.E. Römer, A.J. Huis in 't Veld

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The main advantage of ultrashort laser pulses in manufacturing technology is their very high removal rate of material and high quality of microstructures with the smallest dimensions at 1 μm level. The accuracy is mainly due to almost absence of thermal diffusion into bulk material. In this paper we report the investigation on polycrystalline Cu sample surface treated by 6.7 ps laser pulses with 1030 nm laser light wavelength. Scanning electron microscopy micrographs reveal the presence of jet-like structures with spherical drop-like endings, solidified spheres and many bubble bursts at even lower fluence than the threshold value for the ablation is. Within the molten material the jet-like features are due to an explosion of bubbles originated in solid-liquid-vapor transitions. In the case of below-threshold irradiation the same objects can be seen along surface scratches, dot contaminations etc., which indicate an increase of the laser light absorption on these inhomogeneities
Original languageEnglish
Title of host publicationSurface Effects and Contact Mechanics X
Subtitle of host publicationComputational Methods and Experiments
EditorsJ.T.M De Hosson, C.A Brebbia
Place of PublicationSouthampton
PublisherWIT Press
ISBN (Electronic)978-1-84564-531-1
ISBN (Print)978-1-84564-530-4
Publication statusPublished - 2011
Event10th International Conference on Surface Effects and Contact Mechanics X, 2011 - University of Malta, Valletta, Malta, Spain
Duration: 21 Sep 201123 Sep 2011
Conference number: 10

Publication series

NameWIT Transactions on Engineering Sciences
PublisherWIT Press
ISSN (Print)1746-4471


Conference10th International Conference on Surface Effects and Contact Mechanics X, 2011
Abbreviated titleContact and Surface
CityValletta, Malta
Internet address


  • Electron microscopy
  • Bubbles bursts
  • Laser pulses
  • Thin membranes
  • Jets
  • Scanning Electron Microscopy (SEM)
  • Copper
  • Bubbles


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