Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

Ashok Sridhar; D.J. van Dijk; Remko Akkerman

Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

Ashok Sridhar, D.J. van Dijk, Remko Akkerman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

Original language	Undefined
Title of host publication	3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany
Place of Publication	Frankfurt, Germany
Pages	363-368
Publication status	Published - 2 Nov 2009
Event	3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany: 3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany - Frankfurt, Germany Duration: 2 Nov 2009 → 5 Nov 2009

Conference

Conference	3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany
City	Frankfurt, Germany
Period	2/11/09 → 5/11/09

Keywords

METIS-273987

Cite this

@inproceedings{1a91875dff074683be8475f25ba05b6c,

title = "Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures",

keywords = "METIS-273987",

author = "Ashok Sridhar and {van Dijk}, D.J. and Remko Akkerman",

year = "2009",

month = nov,

day = "2",

language = "Undefined",

pages = "363--368",

booktitle = "3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany",

note = "3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany ; Conference date: 02-11-2009 Through 05-11-2009",

}

Sridhar, A, van Dijk, DJ & Akkerman, R 2009, Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures. in 3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany. Frankfurt, Germany, pp. 363-368, 3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany, Frankfurt, Germany, 2/11/09.

Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures. / Sridhar, Ashok; van Dijk, D.J.; Akkerman, Remko.
3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany. Frankfurt, Germany, 2009. p. 363-368.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

AU - Sridhar, Ashok

AU - van Dijk, D.J.

AU - Akkerman, Remko

PY - 2009/11/2

Y1 - 2009/11/2

KW - METIS-273987

M3 - Conference contribution

SP - 363

EP - 368

BT - 3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany

CY - Frankfurt, Germany

T2 - 3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany

Y2 - 2 November 2009 through 5 November 2009

ER -