Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

Ashok Sridhar, D.J. van Dijk, Remko Akkerman

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    Original languageUndefined
    Title of host publication3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany
    Place of PublicationFrankfurt, Germany
    Pages363-368
    Publication statusPublished - 2 Nov 2009

    Keywords

    • METIS-273987

    Cite this

    Sridhar, A., van Dijk, D. J., & Akkerman, R. (2009). Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures. In 3rd International Student Conference on Print and Media Technology, Printing Future Days 2009, November 2-5, 2009, Chemnitz, Germany (pp. 363-368). Frankfurt, Germany.