Engineering & Materials Science
Physical vapor deposition
94%
Plasma enhanced chemical vapor deposition
91%
Chemical vapor deposition
89%
Boron
87%
Thin films
72%
Microfabrication
48%
Deposition rates
32%
Plasmas
23%
Wet etching
17%
Magnetron sputtering
17%
Chemical resistance
17%
Electron beams
15%
Nanotechnology
14%
Atmospheric pressure
14%
Evaporation
12%
Masks
12%
Surface roughness
10%
Silicon
10%
Substrates
9%
Defects
8%
Chemical analysis
8%
Hot Temperature
6%
Chemistry
Physical Vapour Deposition
100%
Plasma Enhanced Chemical Vapour Deposition
77%
Chemical Vapour Deposition
69%
Boron Atom
66%
Physical Deposition
21%
Electron Beam Evaporation
19%
Plasma Chemical Vapour Deposition
17%
Film Material
17%
Chemical Deposition
16%
Vapor Deposition Process
15%
Chemical Resistance
15%
Pressure
14%
Magnetron Sputtering
14%
Liquid Film
12%
Etching
11%
Plasma
7%
Physics & Astronomy
boron
66%
vapor deposition
59%
synthesis
55%
characterization
42%
thin films
39%
fabrication
17%
etchants
11%
nanofabrication
11%
atmospheric pressure
8%
masks
8%
magnetron sputtering
8%
roughness
7%
evaporation
7%
etching
7%
electron beams
6%
defects
5%
silicon
5%