Chemistry
Amount
14%
Boron Atom
100%
Chemical Resistance
14%
Chemical Vapor Deposition
100%
Electron Beam Evaporation
14%
Engineering Process
14%
Etching
14%
Film Material
14%
Liquid Film
71%
Magnetron Sputtering
14%
Microfabrication
42%
Nanofabrication Process
14%
Number
14%
Phase Composition
14%
Physical Vapor Deposition
100%
Plasma
14%
Plasma Chemical Vapor Deposition
28%
Pressure
28%
Procedure
14%
Rate
28%
Roughness
14%
Silicon
14%
Synthesis (Chemical)
100%
Vapor Phase Deposition
14%
Material Science
Boron
100%
Characterization
100%
Chemical Property
14%
Chemical Resistance
14%
Chemical Vapor Deposition
100%
Magnetron Sputtering
14%
Material
14%
Mechanical Property
14%
Patterning
14%
Physical Vapor Deposition
100%
Plasma-Enhanced Chemical Vapor Deposition
71%
Thin Films
100%
Wet Etching
14%