System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

Hendrikus Tilmans (Inventor), Eric Beyne (Inventor), Henri Jansen (Inventor), Walter De Raedt (Inventor)

    Research output: Patent

    8 Downloads (Pure)

    Abstract

    An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.
    Original languageEnglish
    Patent numberUS20070951739
    Publication statusSubmitted - 6 Dec 2007

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