Tailored Etch-Profiles of high aspect ratio trenches to prevent voids after refill with LPCVD sirn

B.R. de Jong*, H.V. Jansen, M.J. de Boer, G.J.M. Krijnen

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    Abstract

    A study is performed to obtain insight in etch- profile tailoring of high aspect ratio trenches (2 μm wide and 40 μm deep) to achieve void-free refilling with LPCVD SiRN. The trench profile obtained with Bosch DRIE is the most important factor determining formation of voids. Various Bosch recipes are characterized with respect to profile determining features and its applicability in void-free refilling.
    Original languageEnglish
    Title of host publicationProceedings of the 16th MME MicroMechanics Europe Workshop
    Subtitle of host publication4-6 September 2005, Göteborg, Sweden
    EditorsPeter Enoksson
    Place of PublicationGöteborg, Sweden
    PublisherChalmers University of Technology
    Pages1-4
    Number of pages4
    ISBN (Print)91-631-7553-3
    Publication statusPublished - 2005
    Event16th MicroMechanics Europe Workshop, MME 2005 - Göteborg, Sweden
    Duration: 4 Sep 20056 Sep 2005
    Conference number: 16

    Workshop

    Workshop16th MicroMechanics Europe Workshop, MME 2005
    Abbreviated titleMME
    Country/TerritorySweden
    CityGöteborg
    Period4/09/056/09/05

    Keywords

    • Silicon
    • Trench filling
    • Scalloping
    • Nitride
    • LPCVD
    • Void
    • Bosch etching

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