Technological aspects of gaseous pixel detectors fabrication

V.M. Blanco Carballo; Cora Salm; Sander M. Smits; Jurriaan Schmitz; J. Melai; M.A. Chefdeville; H. van der Graaf

Technological aspects of gaseous pixel detectors fabrication

V.M. Blanco Carballo, Cora Salm, Sander M. Smits, Jurriaan Schmitz, J. Melai, M.A. Chefdeville, H. van der Graaf

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress problems. In this paper we describe the several methods we have investigated to fabricate a metal layer on top of a partially crosslinked SU-8 film and the challenges we have encountered. The fabrication process using wafer post processing has been proven, but in cases where single chip processing is desirable, edge bead is a major problem to overcome as it can cover a considerable chip area, reducing the detector performance; we show different techniques to reduce this edge bead and improve detection efficiency.

Original language	Undefined
Title of host publication	10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE)
Place of Publication	Utrecht, The Netherlands
Publisher	STW
Pages	501-503
Number of pages	3
ISBN (Print)	978-90-73461-49-9
Publication status	Published - 29 Nov 2007
Event	10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2007 - Veldhoven, Netherlands Duration: 29 Nov 2007 → 30 Nov 2007

Publication series

Name
Publisher	Technology Foundation STW
Number	7

Workshop

Workshop	10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2007
Country/Territory	Netherlands
City	Veldhoven
Period	29/11/07 → 30/11/07

Keywords

SC-RID: Radiation Imaging detectors
METIS-245937
IR-62114
EWI-11722

Access to Document

http://eprints.eemcs.utwente.nl/secure2/11722/01/blancocarballo.pdf

Cite this

@inproceedings{0433c746e0c94e1195219fa3978e45c1,

title = "Technological aspects of gaseous pixel detectors fabrication",

abstract = "Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress problems. In this paper we describe the several methods we have investigated to fabricate a metal layer on top of a partially crosslinked SU-8 film and the challenges we have encountered. The fabrication process using wafer post processing has been proven, but in cases where single chip processing is desirable, edge bead is a major problem to overcome as it can cover a considerable chip area, reducing the detector performance; we show different techniques to reduce this edge bead and improve detection efficiency.",

keywords = "SC-RID: Radiation Imaging detectors, METIS-245937, IR-62114, EWI-11722",

author = "{Blanco Carballo}, V.M. and Cora Salm and Smits, {Sander M.} and Jurriaan Schmitz and J. Melai and M.A. Chefdeville and {van der Graaf}, H.",

year = "2007",

month = nov,

day = "29",

language = "Undefined",

isbn = "978-90-73461-49-9",

publisher = "STW",

number = "7",

pages = "501--503",

booktitle = "10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE)",

note = "10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2007 ; Conference date: 29-11-2007 Through 30-11-2007",

}

Blanco Carballo, VM, Salm, C , Smits, SM , Schmitz, J, Melai, J, Chefdeville, MA & van der Graaf, H 2007, Technological aspects of gaseous pixel detectors fabrication. in 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE). STW, Utrecht, The Netherlands, pp. 501-503, 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2007, Veldhoven, Netherlands, 29/11/07. <http://eprints.eemcs.utwente.nl/secure2/11722/01/blancocarballo.pdf>

Technological aspects of gaseous pixel detectors fabrication. / Blanco Carballo, V.M.; Salm, Cora ; Smits, Sander M. et al.
10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE). Utrecht, The Netherlands: STW, 2007. p. 501-503.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Technological aspects of gaseous pixel detectors fabrication

AU - Blanco Carballo, V.M.

AU - Salm, Cora

AU - Smits, Sander M.

AU - Schmitz, Jurriaan

AU - Melai, J.

AU - Chefdeville, M.A.

AU - van der Graaf, H.

PY - 2007/11/29

Y1 - 2007/11/29

N2 - Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress problems. In this paper we describe the several methods we have investigated to fabricate a metal layer on top of a partially crosslinked SU-8 film and the challenges we have encountered. The fabrication process using wafer post processing has been proven, but in cases where single chip processing is desirable, edge bead is a major problem to overcome as it can cover a considerable chip area, reducing the detector performance; we show different techniques to reduce this edge bead and improve detection efficiency.

AB - Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress problems. In this paper we describe the several methods we have investigated to fabricate a metal layer on top of a partially crosslinked SU-8 film and the challenges we have encountered. The fabrication process using wafer post processing has been proven, but in cases where single chip processing is desirable, edge bead is a major problem to overcome as it can cover a considerable chip area, reducing the detector performance; we show different techniques to reduce this edge bead and improve detection efficiency.

KW - SC-RID: Radiation Imaging detectors

KW - METIS-245937

KW - IR-62114

KW - EWI-11722

M3 - Conference contribution

SN - 978-90-73461-49-9

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EP - 503

BT - 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE)

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CY - Utrecht, The Netherlands

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Y2 - 29 November 2007 through 30 November 2007

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