Technology alternatives towards low-cost and high-speed interconnect manufacturing

F. Roozeboom, B. Kniknie, A.M. Lankhorst, G. Winands, P. Poodt, G. Dingemans, W. Keuning, W.M.M. Kessels, J.E. Bullema, P.M.M.C. Bressers, G. Oosterhuis, M. Mueller, Bert Huis in 't Veld

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described.
Original languageEnglish
Title of host publicationProceedings of the 12th Annual PanPacific Microelectronics Symposium 2012
Place of PublicationHawaii, USA
PublisherSMTA Pan Pacific
Pages1-9
Publication statusPublished - 14 Feb 2012

Publication series

Name
PublisherSMTA Pan Pacific

Keywords

  • IR-93206
  • METIS-292957

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  • Cite this

    Roozeboom, F., Kniknie, B., Lankhorst, A. M., Winands, G., Poodt, P., Dingemans, G., ... Huis in 't Veld, B. (2012). Technology alternatives towards low-cost and high-speed interconnect manufacturing. In Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012 (pp. 1-9). Hawaii, USA: SMTA Pan Pacific.