Technology alternatives towards low-cost and high-speed interconnect manufacturing

F. Roozeboom; B. Kniknie; A.M. Lankhorst; G. Winands; P. Poodt; G. Dingemans; W. Keuning; W.M.M. Kessels; J.E. Bullema; P.M.M.C. Bressers; G. Oosterhuis; M. Mueller; A.J. Huis in 't Veld

Technology alternatives towards low-cost and high-speed interconnect manufacturing

F. Roozeboom, B. Kniknie, A.M. Lankhorst, G. Winands, P. Poodt, G. Dingemans, W. Keuning, W.M.M. Kessels, J.E. Bullema, P.M.M.C. Bressers, G. Oosterhuis, M. Mueller, A.J. Huis in 't Veld

Faculty of Engineering Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described.

Original language	English
Title of host publication	Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012
Place of Publication	Hawaii, USA
Publisher	SMTA Pan Pacific
Pages	1-9
Publication status	Published - 14 Feb 2012
Event	12th Annual PanPacific Microelectronics Symposium 2012: Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012 - Hawaii, USA Duration: 14 Feb 2012 → 16 Feb 2012

Conference

Conference	12th Annual PanPacific Microelectronics Symposium 2012
City	Hawaii, USA
Period	14/02/12 → 16/02/12

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Roozeboom, F., Kniknie, B., Lankhorst, A. M., Winands, G., Poodt, P., Dingemans, G., Keuning, W., Kessels, W. M. M., Bullema, J. E., Bressers, P. M. M. C., Oosterhuis, G., Mueller, M., & Huis in 't Veld, A. J. (2012). Technology alternatives towards low-cost and high-speed interconnect manufacturing. In Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012 (pp. 1-9). SMTA Pan Pacific. https://smta.org/page/knowledge-search#search/entry-details/5e518802e6d9db0859638fd9/

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title = "Technology alternatives towards low-cost and high-speed interconnect manufacturing",

abstract = "In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described.",

author = "F. Roozeboom and B. Kniknie and A.M. Lankhorst and G. Winands and P. Poodt and G. Dingemans and W. Keuning and W.M.M. Kessels and J.E. Bullema and P.M.M.C. Bressers and G. Oosterhuis and M. Mueller and {Huis in 't Veld}, A.J.",

year = "2012",

month = feb,

day = "14",

language = "English",

pages = "1--9",

booktitle = "Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012",

publisher = "SMTA Pan Pacific",

note = "12th Annual PanPacific Microelectronics Symposium 2012 : Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012 ; Conference date: 14-02-2012 Through 16-02-2012",

}

Roozeboom, F, Kniknie, B, Lankhorst, AM, Winands, G, Poodt, P, Dingemans, G, Keuning, W, Kessels, WMM, Bullema, JE, Bressers, PMMC, Oosterhuis, G, Mueller, M & Huis in 't Veld, AJ 2012, Technology alternatives towards low-cost and high-speed interconnect manufacturing. in Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012. SMTA Pan Pacific, Hawaii, USA, pp. 1-9, 12th Annual PanPacific Microelectronics Symposium 2012, Hawaii, USA, 14/02/12. <https://smta.org/page/knowledge-search#search/entry-details/5e518802e6d9db0859638fd9/>

Technology alternatives towards low-cost and high-speed interconnect manufacturing. / Roozeboom, F.; Kniknie, B.; Lankhorst, A.M. et al.
Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012. Hawaii, USA: SMTA Pan Pacific, 2012. p. 1-9.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Technology alternatives towards low-cost and high-speed interconnect manufacturing

AU - Roozeboom, F.

AU - Kniknie, B.

AU - Lankhorst, A.M.

AU - Winands, G.

AU - Poodt, P.

AU - Dingemans, G.

AU - Keuning, W.

AU - Kessels, W.M.M.

AU - Bullema, J.E.

AU - Bressers, P.M.M.C.

AU - Oosterhuis, G.

AU - Mueller, M.

AU - Huis in 't Veld, A.J.

PY - 2012/2/14

Y1 - 2012/2/14

N2 - In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described.

AB - In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described.

M3 - Conference contribution

SP - 1

EP - 9

BT - Proceedings of the 12th Annual PanPacific Microelectronics Symposium 2012

PB - SMTA Pan Pacific

CY - Hawaii, USA

T2 - 12th Annual PanPacific Microelectronics Symposium 2012

Y2 - 14 February 2012 through 16 February 2012

ER -

Technology alternatives towards low-cost and high-speed interconnect manufacturing

Abstract

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