Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems

Van Hieu Nguyen, Cora Salm, J. Vroemen, J. Voets, B.H. Krabbenborg, B. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    5 Citations (Scopus)
    36 Downloads (Pure)

    Abstract

    Temperature cycling in power ICs is a reliability hazard, even more so when electromigration is playing a role as well. The frequency of the temperature cycling is in the audio domain, which makes it impossible to test in environmental chambers. In the paper, the design and application of a novel test chip to study fast temperature cycling, electromigration and their interaction in multilevel interconnection systems is reported. Incorporated into the test chip are a heating element, a temperature sensor, and extrusion monitors. Simulation was used to study the initial stress distributions after processing and local temperature distributions in the test chip during the temperature transient. First experimental results have been obtained in the area of fast temperature cycling experiments (by using internal heating only) and electromigration experiments. Failure distributions and failure modes are discussed. Results indicate that on-chip cycling is a powerful tool to study reliability of power ICs under realistic conditions.
    Original languageEnglish
    Title of host publicationProceedings of 9th International Symposium on Physics and Failure Analysis 2002
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages135-139
    Number of pages5
    ISBN (Print)0-7803-7416
    DOIs
    Publication statusPublished - 8 Jul 2002
    Event9th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2002 - Singapore, Singapore
    Duration: 8 Jul 200212 Jul 2002
    Conference number: 9

    Conference

    Conference9th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2002
    Abbreviated titleIPFA
    CountrySingapore
    CitySingapore
    Period8/07/0212/07/02

    Keywords

    • METIS-206340
    • IR-43316

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