Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems

H.V. Nguyen; C. Salm; J. Vroemen; J. Voets; B. Krabbenborg; J. Bisschop; A.J. Mouthaan; F.G. Kuper

doi:10.1109/IPFA.2002.1025632

Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems

H.V. Nguyen, C. Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

6 Citations (Scopus)

84 Downloads (Pure)

Abstract

Temperature cycling in power ICs is a reliability hazard, even more so when electromigration is playing a role as well. The frequency of the temperature cycling is in the audio domain, which makes it impossible to test in environmental chambers. In the paper, the design and application of a novel test chip to study fast temperature cycling, electromigration and their interaction in multilevel interconnection systems is reported. Incorporated into the test chip are a heating element, a temperature sensor, and extrusion monitors. Simulation was used to study the initial stress distributions after processing and local temperature distributions in the test chip during the temperature transient. First experimental results have been obtained in the area of fast temperature cycling experiments (by using internal heating only) and electromigration experiments. Failure distributions and failure modes are discussed. Results indicate that on-chip cycling is a powerful tool to study reliability of power ICs under realistic conditions.

Original language	English
Title of host publication	Proceedings of 9th International Symposium on Physics and Failure Analysis 2002
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	135-139
Number of pages	5
ISBN (Print)	0-7803-7416
DOIs	https://doi.org/10.1109/IPFA.2002.1025632
Publication status	Published - 8 Jul 2002
Event	9th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2002 - Singapore, Singapore Duration: 8 Jul 2002 → 12 Jul 2002 Conference number: 9

Conference

Conference	9th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2002
Abbreviated title	IPFA
Country/Territory	Singapore
City	Singapore
Period	8/07/02 → 12/07/02

Keywords

2023 OA procedure

Access to Document

10.1109/IPFA.2002.1025632

ArticleFinal published version, 811 KBLicence: Taverne

Cite this

Nguyen, H. V., Salm, C., Vroemen, J., Voets, J., Krabbenborg, B., Bisschop, J., Mouthaan, A. J., & Kuper, F. G. (2002). Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems. In Proceedings of 9th International Symposium on Physics and Failure Analysis 2002 (pp. 135-139). IEEE. https://doi.org/10.1109/IPFA.2002.1025632

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title = "Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems",

abstract = "Temperature cycling in power ICs is a reliability hazard, even more so when electromigration is playing a role as well. The frequency of the temperature cycling is in the audio domain, which makes it impossible to test in environmental chambers. In the paper, the design and application of a novel test chip to study fast temperature cycling, electromigration and their interaction in multilevel interconnection systems is reported. Incorporated into the test chip are a heating element, a temperature sensor, and extrusion monitors. Simulation was used to study the initial stress distributions after processing and local temperature distributions in the test chip during the temperature transient. First experimental results have been obtained in the area of fast temperature cycling experiments (by using internal heating only) and electromigration experiments. Failure distributions and failure modes are discussed. Results indicate that on-chip cycling is a powerful tool to study reliability of power ICs under realistic conditions.",

keywords = "2023 OA procedure",

author = "H.V. Nguyen and C. Salm and J. Vroemen and J. Voets and B. Krabbenborg and J. Bisschop and A.J. Mouthaan and F.G. Kuper",

year = "2002",

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doi = "10.1109/IPFA.2002.1025632",

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pages = "135--139",

booktitle = "Proceedings of 9th International Symposium on Physics and Failure Analysis 2002",

publisher = "IEEE",

address = "United States",

note = "9th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2002, IPFA ; Conference date: 08-07-2002 Through 12-07-2002",

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Nguyen, HV, Salm, C, Vroemen, J, Voets, J, Krabbenborg, B, Bisschop, J, Mouthaan, AJ & Kuper, FG 2002, Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems. in Proceedings of 9th International Symposium on Physics and Failure Analysis 2002. IEEE, Piscataway, NJ, pp. 135-139, 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2002, Singapore, Singapore, 8/07/02. https://doi.org/10.1109/IPFA.2002.1025632

Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems. / Nguyen, H.V.; Salm, C.; Vroemen, J. et al.
Proceedings of 9th International Symposium on Physics and Failure Analysis 2002. Piscataway, NJ: IEEE, 2002. p. 135-139.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems

AU - Nguyen, H.V.

AU - Salm, C.

AU - Vroemen, J.

AU - Voets, J.

AU - Krabbenborg, B.

AU - Bisschop, J.

AU - Mouthaan, A.J.

AU - Kuper, F.G.

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PY - 2002/7/8

Y1 - 2002/7/8

N2 - Temperature cycling in power ICs is a reliability hazard, even more so when electromigration is playing a role as well. The frequency of the temperature cycling is in the audio domain, which makes it impossible to test in environmental chambers. In the paper, the design and application of a novel test chip to study fast temperature cycling, electromigration and their interaction in multilevel interconnection systems is reported. Incorporated into the test chip are a heating element, a temperature sensor, and extrusion monitors. Simulation was used to study the initial stress distributions after processing and local temperature distributions in the test chip during the temperature transient. First experimental results have been obtained in the area of fast temperature cycling experiments (by using internal heating only) and electromigration experiments. Failure distributions and failure modes are discussed. Results indicate that on-chip cycling is a powerful tool to study reliability of power ICs under realistic conditions.

AB - Temperature cycling in power ICs is a reliability hazard, even more so when electromigration is playing a role as well. The frequency of the temperature cycling is in the audio domain, which makes it impossible to test in environmental chambers. In the paper, the design and application of a novel test chip to study fast temperature cycling, electromigration and their interaction in multilevel interconnection systems is reported. Incorporated into the test chip are a heating element, a temperature sensor, and extrusion monitors. Simulation was used to study the initial stress distributions after processing and local temperature distributions in the test chip during the temperature transient. First experimental results have been obtained in the area of fast temperature cycling experiments (by using internal heating only) and electromigration experiments. Failure distributions and failure modes are discussed. Results indicate that on-chip cycling is a powerful tool to study reliability of power ICs under realistic conditions.

KW - 2023 OA procedure

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BT - Proceedings of 9th International Symposium on Physics and Failure Analysis 2002

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ER -

Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems

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