Test chip for Detecting Thin Film Cracking Induced by Fast Temperature Cycling and Electromigration in Multilevel Interconnect Systems

H.V. Nguyen, C. Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A.J. Mouthaan, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

    6 Citations (Scopus)
    97 Downloads (Pure)

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