The black silicon method: a universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control

Henricus V. Jansen, R. Legtenberg, Meint J. de Boer, Rob Legtenberg, Michael Curt Elwenspoek

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    Abstract

    Very deep treches (up to 200 um) with high aspect ratios (up to 10) in silicon are etched using a fluorine-based plasma (SF6/O2/CHF3). Isotropic, positively and megatively (i.e. reverse) tapered as well as fully vertical walls with smooth surfaces are achieved by controlling the plasma chemistry. A convenient way to find the processing conditions needed for a vertical wall is described: the Black Silicon Method. This new procedure is checked for three different Reactive Ion Etchers (RIE); two parallel plate reactors and a hexode. The influence of the r.f. power, pressure, and gas mixture on the profile will be shown. Scanning Electron Microscope (SEM) photos are included to demonstrate the Black Silicon Method, the influence of the gases on the profile, and the use of this method in fabricating Micro Electro Mechanical Systems (MEMS).
    Original languageEnglish
    Title of host publicationMicro Mechanics Europe 1994
    Place of PublicationPisa, Italy
    PublisherMicroMechanics Europe
    Pages1-5
    Number of pages5
    Publication statusPublished - 5 Sep 1994
    Event5th MicroMechanics Europe Workshop, MME 1994 - Pisa, Italy
    Duration: 5 Sep 19946 Sep 1994
    Conference number: 5

    Conference

    Conference5th MicroMechanics Europe Workshop, MME 1994
    Abbreviated titleMME
    CountryItaly
    CityPisa
    Period5/09/946/09/94

    Keywords

    • METIS-114089
    • EWI-19714
    • IR-17194

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