The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications

Henricus V. Jansen; Meint J. de Boer; M.A. Boer; A.M. Otter; Michael Curt Elwenspoek

doi:10.1109/MEMSYS.1995.472548

The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications

Henricus V. Jansen, Meint J. de Boer, M.A. Boer, A.M. Otter, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

30 Citations (Scopus)

137 Downloads (Pure)

Abstract

The recently developed black silicon method (BSM) is presented as a powerful tool in finding recipes for the fabrication of MEMS building blocks such as Ay-stages. scanning probe tips, inkjet filters, multi-electrodes for neuro-electronic interfaces, and mouldings Lor direct patterning into polymers. The fabrication of these blocks in silicon with high aspect ratios and smooth surface textures will be described and discussed by using the BSM and standard reactive ion etching (ME).

Original language	English
Title of host publication	Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
Place of Publication	Piscataway
Publisher	IEEE Computer Society
Pages	88-93
Number of pages	6
ISBN (Print)	0-7803-2503-6
DOIs	https://doi.org/10.1109/MEMSYS.1995.472548
Publication status	Published - 29 Jan 1995
Event	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995 - Amsterdam, Netherlands Duration: 29 Jan 1995 → 2 Feb 1995

Workshop

Workshop	IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995
Abbreviated title	MEMS
Country/Territory	Netherlands
City	Amsterdam
Period	29/01/95 → 2/02/95

Keywords

EWI-13888
METIS-114124
IR-17229

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10.1109/MEMSYS.1995.472548

black_silicon_method_IVFinal published version, 900 KB

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Jansen, H. V., de Boer, M. J., Boer, M. A., Otter, A. M., & Elwenspoek, M. C. (1995). The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications. In Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE (pp. 88-93). IEEE Computer Society. https://doi.org/10.1109/MEMSYS.1995.472548

Jansen, Henricus V. ; de Boer, Meint J. ; Boer, M.A. ; Otter, A.M. ; Elwenspoek, Michael Curt. / The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications. Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE. Piscataway : IEEE Computer Society, 1995. pp. 88-93

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abstract = "The recently developed black silicon method (BSM) is presented as a powerful tool in finding recipes for the fabrication of MEMS building blocks such as Ay-stages. scanning probe tips, inkjet filters, multi-electrodes for neuro-electronic interfaces, and mouldings Lor direct patterning into polymers. The fabrication of these blocks in silicon with high aspect ratios and smooth surface textures will be described and discussed by using the BSM and standard reactive ion etching (ME).",

keywords = "EWI-13888, METIS-114124, IR-17229",

author = "Jansen, {Henricus V.} and {de Boer}, {Meint J.} and M.A. Boer and A.M. Otter and Elwenspoek, {Michael Curt}",

year = "1995",

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day = "29",

doi = "10.1109/MEMSYS.1995.472548",

language = "English",

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booktitle = "Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE",

publisher = "IEEE Computer Society",

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note = "IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995, MEMS ; Conference date: 29-01-1995 Through 02-02-1995",

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Jansen, HV, de Boer, MJ, Boer, MA, Otter, AM & Elwenspoek, MC 1995, The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications. in Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE. IEEE Computer Society, Piscataway, pp. 88-93, IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995, Amsterdam, Netherlands, 29/01/95. https://doi.org/10.1109/MEMSYS.1995.472548

The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications. / Jansen, Henricus V.; de Boer, Meint J.; Boer, M.A.; Otter, A.M.; Elwenspoek, Michael Curt.

Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE. Piscataway : IEEE Computer Society, 1995. p. 88-93.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - de Boer, Meint J.

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AU - Otter, A.M.

AU - Elwenspoek, Michael Curt

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AB - The recently developed black silicon method (BSM) is presented as a powerful tool in finding recipes for the fabrication of MEMS building blocks such as Ay-stages. scanning probe tips, inkjet filters, multi-electrodes for neuro-electronic interfaces, and mouldings Lor direct patterning into polymers. The fabrication of these blocks in silicon with high aspect ratios and smooth surface textures will be described and discussed by using the BSM and standard reactive ion etching (ME).

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KW - METIS-114124

KW - IR-17229

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DO - 10.1109/MEMSYS.1995.472548

M3 - Conference contribution

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EP - 93

BT - Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE

PB - IEEE Computer Society

CY - Piscataway

T2 - IEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995

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Jansen HV, de Boer MJ, Boer MA, Otter AM, Elwenspoek MC. The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications. In Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE. Piscataway: IEEE Computer Society. 1995. p. 88-93 https://doi.org/10.1109/MEMSYS.1995.472548

The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications

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