The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications

Henricus V. Jansen, Meint J. de Boer, M.A. Boer, A.M. Otter, Michael Curt Elwenspoek

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    Abstract

    The recently developed black silicon method (BSM) is presented as a powerful tool in finding recipes for the fabrication of MEMS building blocks such as Ay-stages. scanning probe tips, inkjet filters, multi-electrodes for neuro-electronic interfaces, and mouldings Lor direct patterning into polymers. The fabrication of these blocks in silicon with high aspect ratios and smooth surface textures will be described and discussed by using the BSM and standard reactive ion etching (ME).
    Original languageEnglish
    Title of host publicationMicro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
    Place of PublicationPiscataway
    PublisherIEEE Computer Society
    Pages88-93
    Number of pages6
    ISBN (Print)0-7803-2503-6
    DOIs
    Publication statusPublished - 29 Jan 1995
    EventIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995 - Amsterdam, Netherlands
    Duration: 29 Jan 19952 Feb 1995

    Workshop

    WorkshopIEEE Workshop on Micro Electro Mechanical Systems, MEMS 1995
    Abbreviated titleMEMS
    CountryNetherlands
    CityAmsterdam
    Period29/01/952/02/95

    Keywords

    • EWI-13888
    • METIS-114124
    • IR-17229

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    Jansen, H. V., de Boer, M. J., Boer, M. A., Otter, A. M., & Elwenspoek, M. C. (1995). The black silicon method IV: the fabrication of three-dimensional structures in silicon with high aspect ratios for scanning probe microscopy and other applications. In Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE (pp. 88-93). Piscataway: IEEE Computer Society. https://doi.org/10.1109/MEMSYS.1995.472548