Abstract
This paper presents a study of various well-known release techniques (bulk- and surface-micromachining) for the fabrication of movable silicon micromechanical structures. Their pro's and con's will be discussed. Further, a detailed study of a new self-aligned plasma technique is presented which uses silicon on insulator wafers (SOI). It has the ability to etch, release, and passivate MEMS in one RIE run. Therefore, MEMS can be fabricated quickly, accurate, and at low costs.
Original language | Undefined |
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Title of host publication | Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2) |
Place of Publication | Piscataway |
Publisher | IEEE |
Pages | 565-568 |
Number of pages | 4 |
ISBN (Print) | 91-630-3473-5 |
Publication status | Published - 25 Jun 1995 |
Event | Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors - Stockholm, Sweden Duration: 25 Jun 1995 → 29 Jun 1995 Conference number: 9 |
Publication series
Name | |
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Publisher | IEEE |
Volume | 1 |
Conference
Conference | Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors |
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Country/Territory | Sweden |
City | Stockholm |
Period | 25/06/95 → 29/06/95 |
Keywords
- EWI-13624
- METIS-114115
- IR-17220