The black silicon method V: a study of the fabricating of movable structures for micro electromechanical systems

Meint J. de Boer, Henricus V. Jansen, Michael Curt Elwenspoek

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    Abstract

    This paper presents a study of various well-known release techniques (bulk- and surface-micromachining) for the fabrication of movable silicon micromechanical structures. Their pro's and con's will be discussed. Further, a detailed study of a new self-aligned plasma technique is presented which uses silicon on insulator wafers (SOI). It has the ability to etch, release, and passivate MEMS in one RIE run. Therefore, MEMS can be fabricated quickly, accurate, and at low costs.
    Original languageUndefined
    Title of host publicationProceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2)
    Place of PublicationPiscataway
    PublisherIEEE
    Pages565-568
    Number of pages4
    ISBN (Print)91-630-3473-5
    Publication statusPublished - 25 Jun 1995
    EventTransducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors - Stockholm, Sweden
    Duration: 25 Jun 199529 Jun 1995
    Conference number: 9

    Publication series

    Name
    PublisherIEEE
    Volume1

    Conference

    ConferenceTransducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors
    CountrySweden
    CityStockholm
    Period25/06/9529/06/95

    Keywords

    • EWI-13624
    • METIS-114115
    • IR-17220

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