The Capability of Truncated Singular Value Decomposition Method for through the Wall Microwave Imaging

Semih Dogu, Hadi Alidoustaghdam, Ismail Dilman, Mehmet Nuri Akinci

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

In this study, a truncated singular value decomposition (TSVD) based computationally efficient through the wall imaging (TWI) is addressed. Mainly, two different scenarios with identical and non-identical multiple scatterers behind the wall have been considered. The scattered data are processed with special scheme in order to improve quality of the results and measurements are performed at four different frequencies. Next, effects of selecting truncation threshold in TSVD methods are analyzed and a detailed quantitative comparison is provided to demonstrate capabilities of these TSVD methods over selection of truncation threshold.

Original languageEnglish
Title of host publicationProceedings of 2020 IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020
EditorsArturs Aboltins, Anna Litvinenko
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages76-81
Number of pages6
ISBN (Electronic)978-1-7281-9398-4
ISBN (Print)978-1-7281-9399-1
DOIs
Publication statusPublished - 1 Oct 2020
Externally publishedYes
Event IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020 - Virtual, Riga, Latvia
Duration: 1 Oct 20202 Oct 2020

Conference

Conference IEEE Workshop on Microwave Theory and Techniques in Wireless Communications, MTTW 2020
Abbreviated titleMTTW 2020
Country/TerritoryLatvia
CityVirtual, Riga
Period1/10/202/10/20

Keywords

  • Inverse scattering theory.
  • Through the wall imaging
  • Truncated singular value decomposition
  • n/a OA procedure

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