The Detection of Defects in a Niobium Tri-layer Process

A. Joseph Arun, Sander Heuvelmans, Gerrit J. Gerritsma, Hans G. Kerkhoff

    Research output: Contribution to journalConference articleAcademicpeer-review

    5 Citations (Scopus)
    52 Downloads (Pure)

    Abstract

    Niobium (Nb) LTS processes are emerging as the technology for future ultra high-speed systems especially in the digital domain. As the number of Josephson Junctions (JJ) per chip has recently increased to around 90000, the quality of the process has to be assured so as to realize these complex circuits. Until now, very little or no information is available in the literature on how to achieve this. In this paper we present an approach and results of a study conducted on an RSFQ process. Measurements and SEM inspection were carried out on sample chips and a list of possible defects has been identified and described in detail. We have also developed test-structures for detection of the top-ranking defects, which will be used for yield analysis and the determination of the probability distribution of faults in the process. A test chip has been designed, based on the results of this study, and certain types of defects were introduced in the design to study the behavior of faulty junctions and interconnections.
    Original languageEnglish
    Pages (from-to)95-98
    Number of pages4
    JournalIEEE transactions on applied superconductivity
    Volume13
    Issue number2
    DOIs
    Publication statusPublished - 2003
    Event2002 Applied Superconductivity Conference, ASC 2002 - Houston, United States
    Duration: 4 Aug 20029 Aug 2002

    Keywords

    • METIS-207854
    • IR-43945
    • Defect-based testing
    • RSFQ circuit testing
    • PDM
    • Superconductor devices
    • Structural testing

    Fingerprint Dive into the research topics of 'The Detection of Defects in a Niobium Tri-layer Process'. Together they form a unique fingerprint.

  • Cite this