Thin alumina films, deposited at 280°C by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2,4, and 17 hr at 600, 700, and 800°C. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.
- scanning-scratch test (SST)
- chemical-vapor deposition (MOCVD)
- thermal annealing
- alumina films
Haanappel, V. A. C., Haanappel, V. A. C., van de Vendel, D., van Corbach, H. D., Fransen, T., & Gellings, P. J. (1995). The effect of thermal annealing on the adherence of Al2O3-films deposited by low-pressure, metal-organic, chemical-vapor deposition on AISI 304. Oxidation of metals, 43(5/6), 459-478. https://doi.org/10.1007/BF01046893