The effect of thermal annealing on the adherence of Al2O3-films deposited by low-pressure, metal-organic, chemical-vapor deposition on AISI 304

V.A.C. Haanappel, V.A.C. Haanappel, D. van de Vendel, H.D. van Corbach, T. Fransen, P.J. Gellings

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Thin alumina films, deposited at 280°C by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2,4, and 17 hr at 600, 700, and 800°C. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.
Original languageUndefined
Pages (from-to)459-478
Number of pages20
JournalOxidation of metals
Issue number5/6
Publication statusPublished - 1995


  • METIS-105477
  • scanning-scratch test (SST)
  • chemical-vapor deposition (MOCVD)
  • thermal annealing
  • alumina films
  • Metal-organic
  • Adherence
  • IR-85592

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