The effect of thermal annealing on the adherence of Al2O3-films deposited by low-pressure, metal-organic, chemical-vapor deposition on AISI 304

V.A.C. Haanappel; D. van de Vendel; H.D. van Corbach; T. Fransen; P.J. Gellings

doi:10.1007/BF01046893

The effect of thermal annealing on the adherence of Al₂O₃-films deposited by low-pressure, metal-organic, chemical-vapor deposition on AISI 304

V.A.C. Haanappel, D. van de Vendel, H.D. van Corbach, T. Fransen, P.J. Gellings

Research output: Contribution to journal › Article › Academic › peer-review

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Abstract

Thin alumina films, deposited at 280°C by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2,4, and 17 hr at 600, 700, and 800°C. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.

Original language	English
Pages (from-to)	459-478
Number of pages	20
Journal	Oxidation of metals
Volume	43
Issue number	5/6
DOIs	https://doi.org/10.1007/BF01046893
Publication status	Published - 1995

Keywords

Scanning-scratch test (SST)
Chemical-vapor deposition (MOCVD)
Thermal annealing
Alumina films
Metal-organic
Adherence

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10.1007/BF01046893

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Cite this

@article{e0e67bb69d194b4297ee05af8d706cc2,

title = "The effect of thermal annealing on the adherence of Al2O3-films deposited by low-pressure, metal-organic, chemical-vapor deposition on AISI 304",

abstract = "Thin alumina films, deposited at 280°C by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2,4, and 17 hr at 600, 700, and 800°C. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.",

keywords = "Scanning-scratch test (SST), Chemical-vapor deposition (MOCVD), Thermal annealing, Alumina films, Metal-organic, Adherence",

author = "V.A.C. Haanappel and {van de Vendel}, D. and {van Corbach}, H.D. and T. Fransen and P.J. Gellings",

year = "1995",

doi = "10.1007/BF01046893",

language = "English",

volume = "43",

pages = "459--478",

journal = "Oxidation of metals",

issn = "0030-770X",

publisher = "Springer",

number = "5/6",

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TY - JOUR

T1 - The effect of thermal annealing on the adherence of Al2O3-films deposited by low-pressure, metal-organic, chemical-vapor deposition on AISI 304

AU - Haanappel, V.A.C.

AU - van de Vendel, D.

AU - van Corbach, H.D.

AU - Fransen, T.

AU - Gellings, P.J.

PY - 1995

Y1 - 1995

N2 - Thin alumina films, deposited at 280°C by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2,4, and 17 hr at 600, 700, and 800°C. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.

AB - Thin alumina films, deposited at 280°C by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2,4, and 17 hr at 600, 700, and 800°C. The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-101, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.

KW - Scanning-scratch test (SST)

KW - Chemical-vapor deposition (MOCVD)

KW - Thermal annealing

KW - Alumina films

KW - Metal-organic

KW - Adherence

U2 - 10.1007/BF01046893

DO - 10.1007/BF01046893

M3 - Article

SN - 0030-770X

VL - 43

SP - 459

EP - 478

JO - Oxidation of metals

JF - Oxidation of metals

IS - 5/6

ER -