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The form of etch rate minima in wet chemical anisotropic etching of silicon

  • Michael Curt Elwenspoek

    Research output: Contribution to journalArticleAcademicpeer-review

    Original languageUndefined
    Pages (from-to)405-409
    JournalJournal of micromechanics and microengineering
    Issue number6
    Publication statusPublished - 1997

    Keywords

    • METIS-111513

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