The future of electronic products: Conductive 3D printing?

O. Diegel*, S. Singamneni, B. Huang, I. Gibson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)

Abstract

This paper describes a curved-layer additive manufacturing technology that has the potential to print plastic components with integral conductive polymer electronic circuits. Researchers at AUT University in New Zealand and the National University of Singapore have developed a novel Fused Deposition Modeling (FDM) process in which the layers of material that make up the part are deposited as curved layers instead of the conventional flat layers. This technology opens up possibilities of building curved plastic parts that have conductive electronic tracks and components printed as an integral part of the plastic component, thereby eliminating printed circuit boards and wiring. It is not possible to do this with existing flat-layer additive manufacturing technologies as the continuity of a circuit could be interrupted between the layers. With curved-layer fused deposition modeling (CLFDM) this problem is removed as continuous filaments in 3 dimensions can be produced, allowing for continuous conductive circuits.

Original languageEnglish
Title of host publicationInnovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping
Pages397-403
Number of pages7
Publication statusPublished - 2010
Externally publishedYes
Event4th International Conference on Advanced Research in Virtual and Physical Prototyping, VRAP 2009 - Leiria, Portugal
Duration: 6 Oct 200910 Oct 2009
Conference number: 4

Conference

Conference4th International Conference on Advanced Research in Virtual and Physical Prototyping, VRAP 2009
Abbreviated titleVRAP 2009
CountryPortugal
CityLeiria
Period6/10/0910/10/09

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