The interconnected wireless world, a major challenge for EM-coexistence

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Abstract

    The number of wireless devices is growing rapidly, and are also deployed in many environments, which is posing new challenges for EMC engineers. This paper discusses the trends and impact, and describes the Electro-Magnetic Diversity as a concept for achieving EM coexistence. The reason for publishing, and the impact of, the new European Radio equipment Directive is discussed. Generic measures to achieve the EM Compatibility, i.e. the required selectivity and low unwanted emission, are given
    Original languageEnglish
    Title of host publication2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility
    Place of PublicationUSA
    PublisherIEEE Electromagnetic Compatibility Society
    Pages502-508
    Number of pages7
    ISBN (Electronic)978-1-5090-5997-3
    ISBN (Print)978-1-5090-3995-5
    DOIs
    Publication statusPublished - 25 Jun 2018
    EventIEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility 2018 - Suntec City, Singapore, Singapore
    Duration: 14 May 201817 May 2018

    Conference

    ConferenceIEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility 2018
    Abbreviated titleEMC/APEMC 2018
    CountrySingapore
    CitySingapore
    Period14/05/1817/05/18

    Fingerprint Dive into the research topics of 'The interconnected wireless world, a major challenge for EM-coexistence'. Together they form a unique fingerprint.

  • Cite this

    Leferink, F. (2018). The interconnected wireless world, a major challenge for EM-coexistence. In 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (pp. 502-508). USA: IEEE Electromagnetic Compatibility Society. https://doi.org/10.1109/ISEMC.2018.8393829