The mechanics and physics of thin film decohesion and its measurement

Arunabha Bagchi; A.G. Evans

doi:10.1007/BF00191045

The mechanics and physics of thin film decohesion and its measurement

Arunabha Bagchi, A.G. Evans

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Abstract

The intent of this review is to utilize the mechanics of thin films in order to define quantitative procedures for predicting interface decohesion motivated by residual stress. The emphasis is on the role of the interface debond energy, especially methods for measuring this parameter in an accurate and reliable manner. Experimental results for metal films on dielectric substrates are reviewed and possible mechanisms are discussed.

Original language	Undefined
Pages (from-to)	169-193
Journal	Interface science
Volume	3
Issue number	3
DOIs	https://doi.org/10.1007/BF00191045
Publication status	Published - 1996

Keywords

IR-85719

Access to Document

10.1007/BF00191045

Bagchi_10.1007_BF00191045

Cite this

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