The mechanics and physics of thin film decohesion and its measurement

Arunabha Bagchi, A.G. Evans

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    The intent of this review is to utilize the mechanics of thin films in order to define quantitative procedures for predicting interface decohesion motivated by residual stress. The emphasis is on the role of the interface debond energy, especially methods for measuring this parameter in an accurate and reliable manner. Experimental results for metal films on dielectric substrates are reviewed and possible mechanisms are discussed.
    Original languageUndefined
    Pages (from-to)169-193
    JournalInterface science
    Issue number3
    Publication statusPublished - 1996


    • IR-85719

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