The Modeling of Electromigration: A New Challenge for TCAD

W. Schoenmaker, V. Petrescu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	Undefined
Title of host publication	Proceedings of The Impact of Deep Submicron Structures on TCAD Developments
Place of Publication	Leuven, Belgium
Pages	2-19
Number of pages	18
Publication status	Published - 15 Dec 1998

Schoenmaker, W., & Petrescu, V. (1998). The Modeling of Electromigration: A New Challenge for TCAD. In Proceedings of The Impact of Deep Submicron Structures on TCAD Developments (pp. 2-19). Leuven, Belgium.

@inproceedings{b96edac39cb94cf2acb3fbf70270f94d,

title = "The Modeling of Electromigration: A New Challenge for TCAD",

keywords = "METIS-113878",

author = "W. Schoenmaker and V. Petrescu",

year = "1998",

month = "12",

day = "15",

language = "Undefined",

pages = "2--19",

booktitle = "Proceedings of The Impact of Deep Submicron Structures on TCAD Developments",

}