The Modeling of Electromigration: A New Challenge for TCAD

W. Schoenmaker, V. Petrescu

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of The Impact of Deep Submicron Structures on TCAD Developments
    Place of PublicationLeuven, Belgium
    Pages2-19
    Number of pages18
    Publication statusPublished - 15 Dec 1998

    Keywords

    • METIS-113878

    Cite this

    Schoenmaker, W., & Petrescu, V. (1998). The Modeling of Electromigration: A New Challenge for TCAD. In Proceedings of The Impact of Deep Submicron Structures on TCAD Developments (pp. 2-19). Leuven, Belgium.
    Schoenmaker, W. ; Petrescu, V. / The Modeling of Electromigration: A New Challenge for TCAD. Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium, 1998. pp. 2-19
    @inproceedings{b96edac39cb94cf2acb3fbf70270f94d,
    title = "The Modeling of Electromigration: A New Challenge for TCAD",
    keywords = "METIS-113878",
    author = "W. Schoenmaker and V. Petrescu",
    year = "1998",
    month = "12",
    day = "15",
    language = "Undefined",
    pages = "2--19",
    booktitle = "Proceedings of The Impact of Deep Submicron Structures on TCAD Developments",

    }

    Schoenmaker, W & Petrescu, V 1998, The Modeling of Electromigration: A New Challenge for TCAD. in Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium, pp. 2-19.

    The Modeling of Electromigration: A New Challenge for TCAD. / Schoenmaker, W.; Petrescu, V.

    Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium, 1998. p. 2-19.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    TY - GEN

    T1 - The Modeling of Electromigration: A New Challenge for TCAD

    AU - Schoenmaker, W.

    AU - Petrescu, V.

    PY - 1998/12/15

    Y1 - 1998/12/15

    KW - METIS-113878

    M3 - Conference contribution

    SP - 2

    EP - 19

    BT - Proceedings of The Impact of Deep Submicron Structures on TCAD Developments

    CY - Leuven, Belgium

    ER -

    Schoenmaker W, Petrescu V. The Modeling of Electromigration: A New Challenge for TCAD. In Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium. 1998. p. 2-19