The Modeling of Electromigration: A New Challenge for TCAD

W. Schoenmaker, V. Petrescu

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationProceedings of The Impact of Deep Submicron Structures on TCAD Developments
    Place of PublicationLeuven, Belgium
    Pages2-19
    Number of pages18
    Publication statusPublished - 15 Dec 1998

    Keywords

    • METIS-113878

    Cite this

    Schoenmaker, W., & Petrescu, V. (1998). The Modeling of Electromigration: A New Challenge for TCAD. In Proceedings of The Impact of Deep Submicron Structures on TCAD Developments (pp. 2-19). Leuven, Belgium.