| Original language | Undefined |
|---|---|
| Title of host publication | Proceedings of The Impact of Deep Submicron Structures on TCAD Developments |
| Place of Publication | Leuven, Belgium |
| Pages | 2-19 |
| Number of pages | 18 |
| Publication status | Published - 15 Dec 1998 |
Keywords
- METIS-113878
Cite this
Schoenmaker, W., & Petrescu, V. (1998). The Modeling of Electromigration: A New Challenge for TCAD. In Proceedings of The Impact of Deep Submicron Structures on TCAD Developments (pp. 2-19). Leuven, Belgium.
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title = "The Modeling of Electromigration: A New Challenge for TCAD",
keywords = "METIS-113878",
author = "W. Schoenmaker and V. Petrescu",
year = "1998",
month = "12",
day = "15",
language = "Undefined",
pages = "2--19",
booktitle = "Proceedings of The Impact of Deep Submicron Structures on TCAD Developments",
}
Schoenmaker, W & Petrescu, V 1998, The Modeling of Electromigration: A New Challenge for TCAD. in Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium, pp. 2-19.
The Modeling of Electromigration: A New Challenge for TCAD. / Schoenmaker, W.; Petrescu, V.
Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium, 1998. p. 2-19.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review
TY - GEN
T1 - The Modeling of Electromigration: A New Challenge for TCAD
AU - Schoenmaker, W.
AU - Petrescu, V.
PY - 1998/12/15
Y1 - 1998/12/15
KW - METIS-113878
M3 - Conference contribution
SP - 2
EP - 19
BT - Proceedings of The Impact of Deep Submicron Structures on TCAD Developments
CY - Leuven, Belgium
ER -
Schoenmaker W, Petrescu V. The Modeling of Electromigration: A New Challenge for TCAD. In Proceedings of The Impact of Deep Submicron Structures on TCAD Developments. Leuven, Belgium. 1998. p. 2-19