The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits

V.A. Kerzerho, Hans G. Kerkhoff, G-J Bollen, Y Xing

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    5 Citations (Scopus)

    Abstract

    This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.
    Original languageUndefined
    Title of host publicationProceedings 17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011
    Place of PublicationUSA
    PublisherIEEE Computer Society
    Pages12-18
    Number of pages6
    ISBN (Print)978-0-7695-4479-3
    DOIs
    Publication statusPublished - 16 May 2011
    Event17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011 - Hotel Mar Monte, Santa Barbara, United States
    Duration: 16 May 201118 May 2011
    Conference number: 17

    Publication series

    Name
    PublisherIEEE Computer Society
    ISSN (Print)0168-275X
    ISSN (Electronic)1875-7103

    Workshop

    Workshop17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011
    Abbreviated titleIMS3TW
    CountryUnited States
    CitySanta Barbara
    Period16/05/1118/05/11

    Keywords

    • IR-79216
    • METIS-285220
    • Design for Reliability
    • Analogue
    • Automotive
    • automated generation
    • PBTI
    • Resilience
    • CAES-TDT: Testable Design and Test
    • EWI-21153
    • reliability simulation
    • mixed-signal

    Cite this