The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits

Vinzent Kerzerho; Hans G. Kerkhoff; Gert-Jan Bollen; Yizi Xing

doi:10.1109/IMS3TW.2011.23

The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits

Vinzent Kerzerho, Hans G. Kerkhoff, Gert-Jan Bollen, Yizi Xing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

5 Citations (Scopus)

30 Downloads (Pure)

Abstract

This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.

Original language	English
Title of host publication	2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop, IMS3TW
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	12-18
Number of pages	6
ISBN (Electronic)	978-0-7695-4479-3
ISBN (Print)	978-1-4577-1144-2
DOIs	https://doi.org/10.1109/IMS3TW.2011.23
Publication status	Published - 16 May 2011
Event	17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011 - Hotel Mar Monte, Santa Barbara, United States Duration: 16 May 2011 → 18 May 2011 Conference number: 17

Workshop

Workshop	17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011
Abbreviated title	IMS3TW
Country/Territory	United States
City	Santa Barbara
Period	16/05/11 → 18/05/11

Keywords

Design for Reliability
Analogue
Automotive
Automated generation
PBTI
Resilience
CAES-TDT: Testable Design and Test
Reliability simulation
Mixed-signal
n/a OA procedure

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10.1109/IMS3TW.2011.23

ArticleAccepted author version, 314 KB

Cite this

@inproceedings{1040545bb24f4a93bebf7299bcd4a17e,

title = "The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits",

abstract = "This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.",

keywords = "Design for Reliability, Analogue, Automotive, Automated generation, PBTI, Resilience, CAES-TDT: Testable Design and Test, Reliability simulation, Mixed-signal, n/a OA procedure",

author = "Vinzent Kerzerho and Kerkhoff, {Hans G.} and Gert-Jan Bollen and Yizi Xing",

year = "2011",

month = may,

day = "16",

doi = "10.1109/IMS3TW.2011.23",

language = "English",

isbn = "978-1-4577-1144-2",

pages = "12--18",

booktitle = "2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop, IMS3TW",

publisher = "IEEE",

address = "United States",

note = "17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011, IMS3TW ; Conference date: 16-05-2011 Through 18-05-2011",

}

Kerzerho, V, Kerkhoff, HG, Bollen, G-J & Xing, Y 2011, The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits. in 2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop, IMS3TW. IEEE, Piscataway, NJ, pp. 12-18, 17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011, Santa Barbara, California, United States, 16/05/11. https://doi.org/10.1109/IMS3TW.2011.23

The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits. / Kerzerho, Vinzent; Kerkhoff, Hans G.; Bollen, Gert-Jan et al.
2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop, IMS3TW. Piscataway, NJ: IEEE, 2011. p. 12-18.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits

AU - Kerzerho, Vinzent

AU - Kerkhoff, Hans G.

AU - Bollen, Gert-Jan

AU - Xing, Yizi

N1 - Conference code: 17

PY - 2011/5/16

Y1 - 2011/5/16

N2 - This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.

AB - This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.

KW - Design for Reliability

KW - Analogue

KW - Automotive

KW - Automated generation

KW - PBTI

KW - Resilience

KW - CAES-TDT: Testable Design and Test

KW - Reliability simulation

KW - Mixed-signal

KW - n/a OA procedure

U2 - 10.1109/IMS3TW.2011.23

DO - 10.1109/IMS3TW.2011.23

M3 - Conference contribution

SN - 978-1-4577-1144-2

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EP - 18

BT - 2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop, IMS3TW

PB - IEEE

CY - Piscataway, NJ

T2 - 17th IEEE International Mixed-Signals, Sensors ans Systems Test Workshop, IMS3TW 2011

Y2 - 16 May 2011 through 18 May 2011

ER -

The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits

Abstract

Workshop

Keywords

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