• 2 Citations

Abstract

A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.
Original languageUndefined
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Place of PublicationPiscataway
PublisherIEEE
Pages290-295
Number of pages6
ISBN (Print)0-7803-5194-0
DOIs
StatePublished - 17 Jan 1999
Event12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999 - Orlando, United States

Publication series

Name
PublisherIEEE

Conference

Conference12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999
Abbreviated titleMEMS
CountryUnited States
CityOrlando
Period17/01/9921/01/99

Fingerprint

Adhesion
Wafer bonding
Binding energy
Interfacial energy

Keywords

  • EWI-13236
  • METIS-112704
  • IR-15822

Cite this

Gui, C., Elwenspoek, M. C., Tas, N. R., & Gardeniers, J. G. E. (1999). The Surface adhesion parameter: A measure for wafer bondability. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (pp. 290-295). Piscataway: IEEE. DOI: 10.1109/MEMSYS.1999.746839

Gui, C.; Elwenspoek, Michael Curt; Tas, Niels Roelof; Gardeniers, Johannes G.E. / The Surface adhesion parameter: A measure for wafer bondability.

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). Piscataway : IEEE, 1999. p. 290-295.

Research output: Scientific - peer-reviewConference contribution

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title = "The Surface adhesion parameter: A measure for wafer bondability",
abstract = "A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.",
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author = "C. Gui and Elwenspoek, {Michael Curt} and Tas, {Niels Roelof} and Gardeniers, {Johannes G.E.}",
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Gui, C, Elwenspoek, MC, Tas, NR & Gardeniers, JGE 1999, The Surface adhesion parameter: A measure for wafer bondability. in Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). IEEE, Piscataway, pp. 290-295, 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999, Orlando, United States, 17-21 January. DOI: 10.1109/MEMSYS.1999.746839

The Surface adhesion parameter: A measure for wafer bondability. / Gui, C.; Elwenspoek, Michael Curt; Tas, Niels Roelof; Gardeniers, Johannes G.E.

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). Piscataway : IEEE, 1999. p. 290-295.

Research output: Scientific - peer-reviewConference contribution

TY - CHAP

T1 - The Surface adhesion parameter: A measure for wafer bondability

AU - Gui,C.

AU - Elwenspoek,Michael Curt

AU - Tas,Niels Roelof

AU - Gardeniers,Johannes G.E.

PY - 1999/1/17

Y1 - 1999/1/17

N2 - A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.

AB - A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.

KW - EWI-13236

KW - METIS-112704

KW - IR-15822

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DO - 10.1109/MEMSYS.1999.746839

M3 - Conference contribution

SN - 0-7803-5194-0

SP - 290

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BT - Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

PB - IEEE

ER -

Gui C, Elwenspoek MC, Tas NR, Gardeniers JGE. The Surface adhesion parameter: A measure for wafer bondability. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE. 1999. p. 290-295. Available from, DOI: 10.1109/MEMSYS.1999.746839