The Surface adhesion parameter: A measure for wafer bondability

C. Gui; Michael Curt Elwenspoek; Niels Roelof Tas; Johannes G.E. Gardeniers

doi:10.1109/MEMSYS.1999.746839

The Surface adhesion parameter: A measure for wafer bondability

C. Gui, Michael Curt Elwenspoek, Niels Roelof Tas, Johannes G.E. Gardeniers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

1091 Downloads (Pure)

Abstract

A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.

Original language	Undefined
Title of host publication	Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Place of Publication	Piscataway
Publisher	IEEE
Pages	290-295
Number of pages	6
ISBN (Print)	0-7803-5194-0
DOIs	https://doi.org/10.1109/MEMSYS.1999.746839
Publication status	Published - 17 Jan 1999
Event	12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999 - Orlando, United States Duration: 17 Jan 1999 → 21 Jan 1999 Conference number: 12

Publication series

Name
Publisher	IEEE

Conference

Conference	12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999
Abbreviated title	MEMS
Country/Territory	United States
City	Orlando
Period	17/01/99 → 21/01/99

Keywords

EWI-13236
METIS-112704
IR-15822

Access to Document

10.1109/MEMSYS.1999.746839

Cite this

@inproceedings{57b7557fbcd8435f9184a6fc6da364b3,

title = "The Surface adhesion parameter: A measure for wafer bondability",

abstract = "A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.",

keywords = "EWI-13236, METIS-112704, IR-15822",

author = "C. Gui and Elwenspoek, {Michael Curt} and Tas, {Niels Roelof} and Gardeniers, {Johannes G.E.}",

year = "1999",

month = jan,

day = "17",

doi = "10.1109/MEMSYS.1999.746839",

language = "Undefined",

isbn = "0-7803-5194-0",

publisher = "IEEE",

pages = "290--295",

booktitle = "Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)",

address = "United States",

note = "12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999 ; Conference date: 17-01-1999 Through 21-01-1999",

}

Gui, C, Elwenspoek, MC, Tas, NR & Gardeniers, JGE 1999, The Surface adhesion parameter: A measure for wafer bondability. in Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). IEEE, Piscataway, pp. 290-295, 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999, Orlando, Florida, United States, 17/01/99. https://doi.org/10.1109/MEMSYS.1999.746839

TY - GEN

T1 - The Surface adhesion parameter: A measure for wafer bondability

AU - Gui, C.

AU - Elwenspoek, Michael Curt

AU - Tas, Niels Roelof

AU - Gardeniers, Johannes G.E.

N1 - Conference code: 12

PY - 1999/1/17

Y1 - 1999/1/17

N2 - A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.

AB - A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, θ. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (θ> approximately equals 12), the bonding regime (θ< approximately equals 1), and the adherence regime (1<θ<12). Experimental data are in agreement with this theory.

KW - EWI-13236

KW - METIS-112704

KW - IR-15822

U2 - 10.1109/MEMSYS.1999.746839

DO - 10.1109/MEMSYS.1999.746839

M3 - Conference contribution

SN - 0-7803-5194-0

SP - 290

EP - 295

BT - Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

PB - IEEE

CY - Piscataway

T2 - 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 1999

Y2 - 17 January 1999 through 21 January 1999

ER -