Abstract
The authors present a subminiature electret microphone which has been realized in silicon using wafer processing techniques. The microphone consists of two conducting plates which form a capacitor. The lower plate (backplate) is rigid and fabricated in silicon. The upper plate (diaphragm) consists of a 6-¿m-thick metallized Mylar foil. In the air cavity between both plates a 1-¿m-thick silicon dioxide electret is present. The fabrication process, such as the construction of the silicon backplate, the realization of the electret, and the diaphragm attachment, are described. The microphones measure 3-mm×3-mm×3-mm and show a sensitivity of 1.4 mV/¿bar and a frequency response within ±1 dB up to 15 kHz
Original language | Undefined |
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Pages | 593-597 |
DOIs | |
Publication status | Published - 1988 |
Event | 6th International Symposium on Electrets, ISE 1988 - Oxford, United Kingdom Duration: 1 Sept 1988 → 3 Sept 1988 Conference number: 6 |
Conference
Conference | 6th International Symposium on Electrets, ISE 1988 |
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Abbreviated title | ISE |
Country/Territory | United Kingdom |
City | Oxford |
Period | 1/09/88 → 3/09/88 |
Keywords
- IR-56114