The use of silicon technology for an electret microphone construction

A.J. Sprenkels, Piet Bergveld

    Research output: Contribution to conferencePaperAcademic

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    Abstract

    The authors present a subminiature electret microphone which has been realized in silicon using wafer processing techniques. The microphone consists of two conducting plates which form a capacitor. The lower plate (backplate) is rigid and fabricated in silicon. The upper plate (diaphragm) consists of a 6-¿m-thick metallized Mylar foil. In the air cavity between both plates a 1-¿m-thick silicon dioxide electret is present. The fabrication process, such as the construction of the silicon backplate, the realization of the electret, and the diaphragm attachment, are described. The microphones measure 3-mm×3-mm×3-mm and show a sensitivity of 1.4 mV/¿bar and a frequency response within ±1 dB up to 15 kHz
    Original languageUndefined
    Pages593-597
    DOIs
    Publication statusPublished - 1988
    Event6th International Symposium on Electrets, ISE 1988 - Oxford, United Kingdom
    Duration: 1 Sep 19883 Sep 1988
    Conference number: 6

    Conference

    Conference6th International Symposium on Electrets, ISE 1988
    Abbreviated titleISE
    CountryUnited Kingdom
    CityOxford
    Period1/09/883/09/88

    Keywords

    • IR-56114

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