Abstract
Thin TiN films have many important applications in Integrated Circuit (IC) technology. In spite of its chemical inertness, it is reported that TiN can be oxidized when exposed to oxidants (O2, H2O, etc.). To avoid an undesired oxidation of the metal-nitride layers, a study on this process is necessary. In this work, we present our study on thermal atomic layer deposition (ALD) of TiN films followed by their dry oxidation in oxygen ambient. For both processes, in-situ monitoring by spectroscopic ellipsometry is carried out.
| Original language | Undefined |
|---|---|
| Title of host publication | Proceedings of the 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors |
| Place of Publication | Utrecht, the Netherlands |
| Publisher | STW |
| Pages | 59-62 |
| Number of pages | 4 |
| ISBN (Print) | 978-90-73461-62-8 |
| Publication status | Published - 26 Nov 2009 |
| Event | 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009 - Veldhoven, Netherlands Duration: 26 Nov 2009 → 27 Nov 2009 Conference number: 12 |
Publication series
| Name | |
|---|---|
| Publisher | Technology Foundation STW |
Conference
| Conference | 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009 |
|---|---|
| Abbreviated title | SAFE |
| Country/Territory | Netherlands |
| City | Veldhoven |
| Period | 26/11/09 → 27/11/09 |
Keywords
- METIS-264273
- IR-69059
- Atomic Layer Deposition
- ALD
- TiN
- EWI-17068
- Titanium oxide
- Spectroscopic ellipsometry
- Dry oxidation
- SC-ICF: Integrated Circuit Fabrication
- Titanium Nitride