Thermal issues in test: An overview of the significant aspects and industrial practice

J. Alt, P. Bernardi, A. Bosio, R. Cantoro, Hans G. Kerkhoff, A Leininger, W. Molzer, A. Motta, C. Pacha, A Pagani, A. Rohani, S. Strasser

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    4 Citations (Scopus)

    Abstract

    Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.
    Original languageUndefined
    Title of host publicationIEEE 34th VLSI Test Symposium (VTS 2016)
    Place of PublicationUSA
    PublisherIEEE
    Pages1-4
    Number of pages4
    ISBN (Print)978-1-4673-8454-4
    DOIs
    Publication statusPublished - Apr 2016
    Event34th IEEE VLSI Test Symposium, VTS 2016 - Las Vegas, United States
    Duration: 25 Apr 201627 Apr 2016
    Conference number: 34

    Publication series

    Name
    PublisherIEEE

    Conference

    Conference34th IEEE VLSI Test Symposium, VTS 2016
    Abbreviated titleVTS
    CountryUnited States
    CityLas Vegas
    Period25/04/1627/04/16

    Keywords

    • CAES-TDT: Testable Design and Test
    • EC Grant Agreement nr.: FP7/619871
    • IR-101090
    • METIS-318484
    • EWI-27122

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