Thermal issues in test: An overview of the significant aspects and industrial practice

J. Alt; P. Bernardi; A. Bosio; R. Cantoro; Hans G. Kerkhoff; A Leininger; W. Molzer; A. Motta; C. Pacha; A Pagani; A. Rohani; S. Strasser

doi:10.1109/VTS.2016.7477278

Thermal issues in test: An overview of the significant aspects and industrial practice

J. Alt, P. Bernardi, A. Bosio, R. Cantoro, Hans G. Kerkhoff, A Leininger, W. Molzer, A. Motta, C. Pacha, A Pagani, A. Rohani, S. Strasser

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

4 Citations (Scopus)

15 Downloads (Pure)

Abstract

Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.

Original language	Undefined
Title of host publication	IEEE 34th VLSI Test Symposium (VTS 2016)
Place of Publication	USA
Publisher	IEEE
Pages	1-4
Number of pages	4
ISBN (Print)	978-1-4673-8454-4
DOIs	https://doi.org/10.1109/VTS.2016.7477278
Publication status	Published - Apr 2016
Event	34th IEEE VLSI Test Symposium, VTS 2016 - Las Vegas, United States Duration: 25 Apr 2016 → 27 Apr 2016 Conference number: 34

Publication series

Name
Publisher	IEEE

Conference

Conference	34th IEEE VLSI Test Symposium, VTS 2016
Abbreviated title	VTS
Country/Territory	United States
City	Las Vegas
Period	25/04/16 → 27/04/16

Keywords

CAES-TDT: Testable Design and Test
EC Grant Agreement nr.: FP7/619871
IR-101090
METIS-318484
EWI-27122

Access to Document

10.1109/VTS.2016.7477278

http://eprints.eemcs.utwente.nl/secure2/27122/01/07477278.pdf

Cite this

@inproceedings{5915ce4682354dc29690660c2139cada,

title = "Thermal issues in test: An overview of the significant aspects and industrial practice",

abstract = "Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.",

keywords = "CAES-TDT: Testable Design and Test, EC Grant Agreement nr.: FP7/619871, IR-101090, METIS-318484, EWI-27122",

author = "J. Alt and P. Bernardi and A. Bosio and R. Cantoro and Kerkhoff, {Hans G.} and A Leininger and W. Molzer and A. Motta and C. Pacha and A Pagani and A. Rohani and S. Strasser",

note = "eemcs-eprint-27122 ; 34th IEEE VLSI Test Symposium, VTS 2016 ; Conference date: 25-04-2016 Through 27-04-2016",

year = "2016",

month = apr,

doi = "10.1109/VTS.2016.7477278",

language = "Undefined",

isbn = "978-1-4673-8454-4",

publisher = "IEEE",

pages = "1--4",

booktitle = "IEEE 34th VLSI Test Symposium (VTS 2016)",

address = "United States",

}

Alt, J, Bernardi, P, Bosio, A, Cantoro, R, Kerkhoff, HG, Leininger, A, Molzer, W, Motta, A, Pacha, C, Pagani, A, Rohani, A & Strasser, S 2016, Thermal issues in test: An overview of the significant aspects and industrial practice. in IEEE 34th VLSI Test Symposium (VTS 2016). IEEE, USA, pp. 1-4, 34th IEEE VLSI Test Symposium, VTS 2016, Las Vegas, Nevada, United States, 25/04/16. https://doi.org/10.1109/VTS.2016.7477278

TY - GEN

T1 - Thermal issues in test: An overview of the significant aspects and industrial practice

AU - Alt, J.

AU - Bernardi, P.

AU - Bosio, A.

AU - Cantoro, R.

AU - Kerkhoff, Hans G.

AU - Leininger, A

AU - Molzer, W.

AU - Motta, A.

AU - Pacha, C.

AU - Pagani, A

AU - Rohani, A.

AU - Strasser, S.

N1 - Conference code: 34

PY - 2016/4

Y1 - 2016/4

N2 - Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.

AB - Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.

KW - CAES-TDT: Testable Design and Test

KW - EC Grant Agreement nr.: FP7/619871

KW - IR-101090

KW - METIS-318484

KW - EWI-27122

U2 - 10.1109/VTS.2016.7477278

DO - 10.1109/VTS.2016.7477278

M3 - Conference contribution

SN - 978-1-4673-8454-4

SP - 1

EP - 4

BT - IEEE 34th VLSI Test Symposium (VTS 2016)

PB - IEEE

CY - USA

T2 - 34th IEEE VLSI Test Symposium, VTS 2016

Y2 - 25 April 2016 through 27 April 2016

ER -