Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

Wessel Willems Wits; R. Legtenberg; Jan Mannak; Bas van Zalk

doi:10.1109/IEMT.2006.4456432

Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

Wessel Willems Wits, R. Legtenberg, Jan Mannak, Bas van Zalk

Faculty of Engineering Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

11 Citations (Scopus)

Abstract

A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.

Original language	English
Title of host publication	Proceedings of the 31st International Electronic Manufacturing Technology Symposium
Editors	A. Aripin
Place of Publication	Petaling Yaja, Malaysia
Publisher	IEEE
Pages	55-61
ISBN (Print)	142440729X
DOIs	https://doi.org/10.1109/IEMT.2006.4456432
Publication status	Published - 8 Nov 2006
Event	The 31st International Electronic Manufacturing Technology Symposium, IEMT 2006: Proceedings of the 31st International Electronic Manufacturing Technology Symposium - Petaling Yaja, Malaysia Duration: 8 Nov 2006 → 10 Nov 2006

Publication series

Name
Publisher	IEEE
ISSN (Print)	1089-8190

Conference

Conference	The 31st International Electronic Manufacturing Technology Symposium, IEMT 2006
City	Petaling Yaja, Malaysia
Period	8/11/06 → 10/11/06

Keywords

METIS-235365
IR-92503

Access to Document

10.1109/IEMT.2006.4456432

Cite this

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title = "Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology",

abstract = "A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.",

keywords = "METIS-235365, IR-92503",

author = "Wits, {Wessel Willems} and R. Legtenberg and Jan Mannak and {van Zalk}, Bas",

year = "2006",

month = nov,

day = "8",

doi = "10.1109/IEMT.2006.4456432",

language = "English",

isbn = "142440729X",

publisher = "IEEE",

pages = "55--61",

editor = "A. Aripin",

booktitle = "Proceedings of the 31st International Electronic Manufacturing Technology Symposium",

note = "The 31st International Electronic Manufacturing Technology Symposium, IEMT 2006 : Proceedings of the 31st International Electronic Manufacturing Technology Symposium ; Conference date: 08-11-2006 Through 10-11-2006",

}

Wits, WW, Legtenberg, R, Mannak, J & van Zalk, B 2006, Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology. in A Aripin (ed.), Proceedings of the 31st International Electronic Manufacturing Technology Symposium. IEEE, Petaling Yaja, Malaysia, pp. 55-61, The 31st International Electronic Manufacturing Technology Symposium, IEMT 2006, Petaling Yaja, Malaysia, 8/11/06. https://doi.org/10.1109/IEMT.2006.4456432

Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology. / Wits, Wessel Willems; Legtenberg, R.; Mannak, Jan et al.

Proceedings of the 31st International Electronic Manufacturing Technology Symposium. ed. / A. Aripin. Petaling Yaja, Malaysia : IEEE, 2006. p. 55-61.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

AU - Wits, Wessel Willems

AU - Legtenberg, R.

AU - Mannak, Jan

AU - van Zalk, Bas

PY - 2006/11/8

Y1 - 2006/11/8

N2 - A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.

AB - A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.

KW - METIS-235365

KW - IR-92503

U2 - 10.1109/IEMT.2006.4456432

DO - 10.1109/IEMT.2006.4456432

M3 - Conference contribution

SN - 142440729X

SP - 55

EP - 61

BT - Proceedings of the 31st International Electronic Manufacturing Technology Symposium

A2 - Aripin, A.

PB - IEEE

CY - Petaling Yaja, Malaysia

T2 - The 31st International Electronic Manufacturing Technology Symposium, IEMT 2006

Y2 - 8 November 2006 through 10 November 2006

ER -

Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

Abstract

Publication series

Conference

Keywords

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Cite this