TY - GEN
T1 - Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology
AU - Wits, Wessel Willems
AU - Legtenberg, R.
AU - Mannak, Jan
AU - van Zalk, Bas
PY - 2006/11/8
Y1 - 2006/11/8
N2 - A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.
AB - A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.
KW - METIS-235365
KW - IR-92503
U2 - 10.1109/IEMT.2006.4456432
DO - 10.1109/IEMT.2006.4456432
M3 - Conference contribution
SN - 142440729X
SP - 55
EP - 61
BT - Proceedings of the 31st International Electronic Manufacturing Technology Symposium
A2 - Aripin, A.
PB - IEEE
CY - Petaling Yaja, Malaysia
T2 - The 31st International Electronic Manufacturing Technology Symposium, IEMT 2006
Y2 - 8 November 2006 through 10 November 2006
ER -