Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

Wessel Willems Wits, R. Legtenberg, Jan Mannak, Bas van Zalk

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

6 Citations (Scopus)

Abstract

A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.
Original languageEnglish
Title of host publicationProceedings of the 31st International Electronic Manufacturing Technology Symposium
EditorsA. Aripin
Place of PublicationPetaling Yaja, Malaysia
PublisherIEEE
Pages55-61
ISBN (Print)142440729X
DOIs
Publication statusPublished - 8 Nov 2006
EventThe 31st International Electronic Manufacturing Technology Symposium, IEMT 2006: Proceedings of the 31st International Electronic Manufacturing Technology Symposium - Petaling Yaja, Malaysia
Duration: 8 Nov 200610 Nov 2006

Publication series

Name
PublisherIEEE
ISSN (Print)1089-8190

Conference

ConferenceThe 31st International Electronic Manufacturing Technology Symposium, IEMT 2006
CityPetaling Yaja, Malaysia
Period8/11/0610/11/06

Keywords

  • METIS-235365
  • IR-92503

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