Thermal Resistivity of FFF Printed Carbon Black Doped Polymers

Heime Jonkers; Dimitrios Kosmas; Jurriaan Schmitz; Gijs Krijnen

doi:10.1109/FLEPS57599.2023.10220388

Thermal Resistivity of FFF Printed Carbon Black Doped Polymers

Heime Jonkers^*, Dimitrios Kosmas, Jurriaan Schmitz, Gijs Krijnen

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

3 Citations (Scopus)

51 Downloads (Pure)

Abstract

Carbon black doped polymer filaments for Fused Filament Fabrication (FFF) have previously been shown to exhibit temperature dependent resistance. In this work three commercially available filaments were characterized by thermal treatment and exposure, whilst monitoring their electrical resistance. Temperature coefficients of resistance were determined for the materials, along with the influence of printing orientation.

Original language	English
Title of host publication	2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
Publisher	IEEE
ISBN (Electronic)	978-1-6654-5733-0
DOIs	https://doi.org/10.1109/FLEPS57599.2023.10220388
Publication status	Published - 28 Aug 2023
Event	International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 - Boston, United States Duration: 9 Jul 2023 → 12 Jul 2023 https://2023.ieee-fleps.org/

Conference

Conference	International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023
Abbreviated title	FLEPS 2023
Country/Territory	United States
City	Boston
Period	9/07/23 → 12/07/23
Internet address	https://2023.ieee-fleps.org/

Keywords

2023 OA procedure

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/FLEPS57599.2023.10220388

Thermal_Resistivity_of_FFF_Printed_Carbon_Black_Doped_PolymersFinal published version, 700 KBLicence: Taverne

Cite this

@inproceedings{6103585175a34e2aa714f2b8e0ed3703,

title = "Thermal Resistivity of FFF Printed Carbon Black Doped Polymers",

abstract = "Carbon black doped polymer filaments for Fused Filament Fabrication (FFF) have previously been shown to exhibit temperature dependent resistance. In this work three commercially available filaments were characterized by thermal treatment and exposure, whilst monitoring their electrical resistance. Temperature coefficients of resistance were determined for the materials, along with the influence of printing orientation.",

keywords = "2023 OA procedure",

author = "Heime Jonkers and Dimitrios Kosmas and Jurriaan Schmitz and Gijs Krijnen",

year = "2023",

month = aug,

day = "28",

doi = "10.1109/FLEPS57599.2023.10220388",

language = "English",

booktitle = "2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)",

publisher = "IEEE",

address = "United States",

note = "International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023, FLEPS 2023 ; Conference date: 09-07-2023 Through 12-07-2023",

url = "https://2023.ieee-fleps.org/",

}

Jonkers, H, Kosmas, D , Schmitz, J & Krijnen, G 2023, Thermal Resistivity of FFF Printed Carbon Black Doped Polymers. in 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). IEEE, International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023, Boston, Massachusetts, United States, 9/07/23. https://doi.org/10.1109/FLEPS57599.2023.10220388

TY - GEN

T1 - Thermal Resistivity of FFF Printed Carbon Black Doped Polymers

AU - Jonkers, Heime

AU - Kosmas, Dimitrios

AU - Schmitz, Jurriaan

AU - Krijnen, Gijs

PY - 2023/8/28

Y1 - 2023/8/28

N2 - Carbon black doped polymer filaments for Fused Filament Fabrication (FFF) have previously been shown to exhibit temperature dependent resistance. In this work three commercially available filaments were characterized by thermal treatment and exposure, whilst monitoring their electrical resistance. Temperature coefficients of resistance were determined for the materials, along with the influence of printing orientation.

AB - Carbon black doped polymer filaments for Fused Filament Fabrication (FFF) have previously been shown to exhibit temperature dependent resistance. In this work three commercially available filaments were characterized by thermal treatment and exposure, whilst monitoring their electrical resistance. Temperature coefficients of resistance were determined for the materials, along with the influence of printing orientation.

KW - 2023 OA procedure

U2 - 10.1109/FLEPS57599.2023.10220388

DO - 10.1109/FLEPS57599.2023.10220388

M3 - Conference contribution

BT - 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

PB - IEEE

T2 - International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023

Y2 - 9 July 2023 through 12 July 2023

ER -

Thermal Resistivity of FFF Printed Carbon Black Doped Polymers

Abstract

Conference

Keywords

UN SDGs

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