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Thermal Resistivity of FFF Printed Carbon Black Doped Polymers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Carbon black doped polymer filaments for Fused Filament Fabrication (FFF) have previously been shown to exhibit temperature dependent resistance. In this work three commercially available filaments were characterized by thermal treatment and exposure, whilst monitoring their electrical resistance. Temperature coefficients of resistance were determined for the materials, along with the influence of printing orientation.
Original languageEnglish
Title of host publication2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
PublisherIEEE
ISBN (Electronic)978-1-6654-5733-0
DOIs
Publication statusPublished - 28 Aug 2023
EventInternational Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 - Boston, United States
Duration: 9 Jul 2023 → 12 Jul 2023
https://2023.ieee-fleps.org/

Conference

ConferenceInternational Conference on Flexible and Printable Sensors and Systems, FLEPS 2023
Abbreviated titleFLEPS 2023
Country/TerritoryUnited States
CityBoston
Period9/07/23 → 12/07/23
Internet address

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • 2023 OA procedure

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