Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

Marius Dumitrescu, Cornel Cobianu, Dan Lungu, Adrian Pascu, Spas Kolev, Albert van den Berg

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    A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element ‘COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized layout based on four ‘poly' suspended bridges and a central ‘poly' pillar supporting the 110×110 μm2 ‘poly' membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.
    Original languageUndefined
    Pages (from-to)51-56
    JournalSensors and actuators. A: Physical
    Issue number1-3
    Publication statusPublished - 1999


    • Micro hot plate
    • Thermal simulation
    • Surface micromachining
    • IR-73992
    • Polysilicon membrane

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