Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

Marius Dumitrescu*, Cornel Cobianu, Dan Lungu, Dan Dascalu, Adrian Pascu, Spas Kolev, Albert van den Berg

*Corresponding author for this work

Research output: Contribution to conferencePaper

Abstract

A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element `COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized lay-out based on four `poly' suspended bridges and a central `poly' pillar supporting the 110×110 μm `poly' membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.

Original languageEnglish
Pages83-86
Number of pages4
Publication statusPublished - 1 Jan 1998
Externally publishedYes
Event21st International Semiconductor Conference, CAS'98 - Sinaia, Romania
Duration: 6 Oct 199810 Oct 1998
Conference number: 21

Conference

Conference21st International Semiconductor Conference, CAS'98
Abbreviated titleCAS 1998
CountryRomania
CitySinaia
Period6/10/9810/10/98

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    Dumitrescu, M., Cobianu, C., Lungu, D., Dascalu, D., Pascu, A., Kolev, S., & van den Berg, A. (1998). Thermal simulation of surface micromachined polysilicon hot plates of low power consumption. 83-86. Paper presented at 21st International Semiconductor Conference, CAS'98, Sinaia, Romania.