Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

Marius Dumitrescu; Cornel Cobianu; Dan Lungu; Dan Dascalu; Adrian Pascu; Spas Kolev; Albert van den Berg

Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

Marius Dumitrescu^*, Cornel Cobianu, Dan Lungu, Dan Dascalu, Adrian Pascu, Spas Kolev, Albert van den Berg

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

1 Citation (Scopus)

Abstract

A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element `COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized lay-out based on four `poly' suspended bridges and a central `poly' pillar supporting the 110×110 μm `poly' membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.

Original language	English
Pages	83-86
Number of pages	4
Publication status	Published - 1 Jan 1998
Externally published	Yes
Event	21st International Semiconductor Conference, CAS'98 - Sinaia, Romania Duration: 6 Oct 1998 → 10 Oct 1998 Conference number: 21

Conference

Conference	21st International Semiconductor Conference, CAS'98
Abbreviated title	CAS 1998
Country/Territory	Romania
City	Sinaia
Period	6/10/98 → 10/10/98

Cite this

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title = "Thermal simulation of surface micromachined polysilicon hot plates of low power consumption",

abstract = "A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element `COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized lay-out based on four `poly' suspended bridges and a central `poly' pillar supporting the 110×110 μm `poly' membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.",

author = "Marius Dumitrescu and Cornel Cobianu and Dan Lungu and Dan Dascalu and Adrian Pascu and Spas Kolev and {van den Berg}, Albert",

year = "1998",

month = jan,

day = "1",

language = "English",

pages = "83--86",

note = "21st International Semiconductor Conference, CAS'98, CAS 1998 ; Conference date: 06-10-1998 Through 10-10-1998",

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TY - CONF

T1 - Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

AU - Dumitrescu, Marius

AU - Cobianu, Cornel

AU - Lungu, Dan

AU - Dascalu, Dan

AU - Pascu, Adrian

AU - Kolev, Spas

AU - van den Berg, Albert

N1 - Conference code: 21

PY - 1998/1/1

Y1 - 1998/1/1

N2 - A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element `COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized lay-out based on four `poly' suspended bridges and a central `poly' pillar supporting the 110×110 μm `poly' membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.

AB - A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element `COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized lay-out based on four `poly' suspended bridges and a central `poly' pillar supporting the 110×110 μm `poly' membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW.

UR - http://www.scopus.com/inward/record.url?scp=0032316875&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0032316875

SP - 83

EP - 86

T2 - 21st International Semiconductor Conference, CAS'98

Y2 - 6 October 1998 through 10 October 1998

ER -

Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

Abstract

Conference

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