Thermodynamic analysis of semiconductor structures using a device simulator and lumped circuit modelling

A.J. Mouthaan, B.H. Krabbenborg

    Research output: Contribution to journalArticleAcademicpeer-review

    Original languageUndefined
    Pages (from-to)125-137
    JournalSensors and materials
    Volume6
    Issue number2
    Publication statusPublished - 1994

    Keywords

    • METIS-112057

    Cite this

    @article{8208074ad34a47088a575a989016b82d,
    title = "Thermodynamic analysis of semiconductor structures using a device simulator and lumped circuit modelling",
    keywords = "METIS-112057",
    author = "A.J. Mouthaan and B.H. Krabbenborg",
    year = "1994",
    language = "Undefined",
    volume = "6",
    pages = "125--137",
    journal = "Sensors and materials",
    issn = "0914-4935",
    publisher = "M Y U Scientific Publishing Division",
    number = "2",

    }

    Thermodynamic analysis of semiconductor structures using a device simulator and lumped circuit modelling. / Mouthaan, A.J.; Krabbenborg, B.H.

    In: Sensors and materials, Vol. 6, No. 2, 1994, p. 125-137.

    Research output: Contribution to journalArticleAcademicpeer-review

    TY - JOUR

    T1 - Thermodynamic analysis of semiconductor structures using a device simulator and lumped circuit modelling

    AU - Mouthaan, A.J.

    AU - Krabbenborg, B.H.

    PY - 1994

    Y1 - 1994

    KW - METIS-112057

    M3 - Article

    VL - 6

    SP - 125

    EP - 137

    JO - Sensors and materials

    JF - Sensors and materials

    SN - 0914-4935

    IS - 2

    ER -