Three-axis force-torque sensor with fully differential capacitive readout

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    Abstract

    We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.
    Original languageUndefined
    Title of host publication29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
    Place of PublicationPiscataway, NJ, USA
    PublisherIEEE
    Pages885-888
    Number of pages4
    ISBN (Print)978-1-5090-1973-1
    DOIs
    Publication statusPublished - 24 Jan 2016
    Event29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China
    Duration: 24 Jan 201628 Jan 2016
    Conference number: 29

    Publication series

    Name
    PublisherIEEE

    Conference

    Conference29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
    Abbreviated titleMEMS
    CountryChina
    CityShanghai
    Period24/01/1628/01/16

    Keywords

    • EWI-27766
    • IR-103622
    • METIS-321732

    Cite this

    Brookhuis, R. A., Sanders, R. G. P., Sikkens, B. N. A., & Wiegerink, R. J. (2016). Three-axis force-torque sensor with fully differential capacitive readout. In 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 (pp. 885-888). Piscataway, NJ, USA: IEEE. https://doi.org/10.1109/MEMSYS.2016.7421772