Three-axis force-torque sensor with fully differential capacitive readout

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

5 Citations (Scopus)
1 Downloads (Pure)

Abstract

We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.
Original languageUndefined
Title of host publication29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Place of PublicationPiscataway, NJ, USA
PublisherIEEE
Pages885-888
Number of pages4
ISBN (Print)978-1-5090-1973-1
DOIs
Publication statusPublished - 24 Jan 2016
Event29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China
Duration: 24 Jan 201628 Jan 2016
Conference number: 29

Publication series

Name
PublisherIEEE

Conference

Conference29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Abbreviated titleMEMS
CountryChina
CityShanghai
Period24/01/1628/01/16

Keywords

  • EWI-27766
  • IR-103622
  • METIS-321732

Cite this

Brookhuis, R. A., Sanders, R. G. P., Sikkens, B. N. A., & Wiegerink, R. J. (2016). Three-axis force-torque sensor with fully differential capacitive readout. In 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 (pp. 885-888). Piscataway, NJ, USA: IEEE. https://doi.org/10.1109/MEMSYS.2016.7421772
Brookhuis, Robert Anton ; Sanders, Remco G.P. ; Sikkens, Boudewijn N.A. ; Wiegerink, Remco J. / Three-axis force-torque sensor with fully differential capacitive readout. 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016. Piscataway, NJ, USA : IEEE, 2016. pp. 885-888
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abstract = "We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.",
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author = "Brookhuis, {Robert Anton} and Sanders, {Remco G.P.} and Sikkens, {Boudewijn N.A.} and Wiegerink, {Remco J.}",
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Brookhuis, RA, Sanders, RGP, Sikkens, BNA & Wiegerink, RJ 2016, Three-axis force-torque sensor with fully differential capacitive readout. in 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016. IEEE, Piscataway, NJ, USA, pp. 885-888, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24/01/16. https://doi.org/10.1109/MEMSYS.2016.7421772

Three-axis force-torque sensor with fully differential capacitive readout. / Brookhuis, Robert Anton; Sanders, Remco G.P.; Sikkens, Boudewijn N.A.; Wiegerink, Remco J.

29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016. Piscataway, NJ, USA : IEEE, 2016. p. 885-888.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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N2 - We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.

AB - We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.

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Brookhuis RA, Sanders RGP, Sikkens BNA, Wiegerink RJ. Three-axis force-torque sensor with fully differential capacitive readout. In 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016. Piscataway, NJ, USA: IEEE. 2016. p. 885-888 https://doi.org/10.1109/MEMSYS.2016.7421772