Three-axis force-torque sensor with fully differential capacitive readout

Robert Anton Brookhuis; Remco G.P. Sanders; Boudewijn N.A. Sikkens; Remco J. Wiegerink

doi:10.1109/MEMSYS.2016.7421772

Three-axis force-torque sensor with fully differential capacitive readout

Robert Anton Brookhuis
, Remco G.P. Sanders
, Boudewijn N.A. Sikkens
, Remco J. Wiegerink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

9 Citations (Scopus)

6 Downloads (Pure)

Abstract

We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.

Original language	Undefined
Title of host publication	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	885-888
Number of pages	4
ISBN (Print)	978-1-5090-1973-1
DOIs	https://doi.org/10.1109/MEMSYS.2016.7421772
Publication status	Published - 24 Jan 2016
Event	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China Duration: 24 Jan 2016 → 28 Jan 2016 Conference number: 29

Publication series

Name
Publisher	IEEE

Conference

Conference	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Abbreviated title	MEMS
Country/Territory	China
City	Shanghai
Period	24/01/16 → 28/01/16

Keywords

EWI-27766
IR-103622
METIS-321732

Access to Document

10.1109/MEMSYS.2016.7421772

Cite this

@inproceedings{9fe6af6131d14cb287db2dce92a30ac5,

title = "Three-axis force-torque sensor with fully differential capacitive readout",

abstract = "We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.",

keywords = "EWI-27766, IR-103622, METIS-321732",

author = "Brookhuis, \{Robert Anton\} and Sanders, \{Remco G.P.\} and Sikkens, \{Boudewijn N.A.\} and Wiegerink, \{Remco J.\}",

note = "eemcs-eprint-27766 ; 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 ; Conference date: 24-01-2016 Through 28-01-2016",

year = "2016",

month = jan,

day = "24",

doi = "10.1109/MEMSYS.2016.7421772",

language = "Undefined",

isbn = "978-1-5090-1973-1",

publisher = "IEEE",

pages = "885--888",

booktitle = "29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016",

address = "United States",

}

Brookhuis, RA, Sanders, RGP, Sikkens, BNA & Wiegerink, RJ 2016, Three-axis force-torque sensor with fully differential capacitive readout. in 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016. IEEE, Piscataway, NJ, USA, pp. 885-888, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24/01/16. https://doi.org/10.1109/MEMSYS.2016.7421772

Three-axis force-torque sensor with fully differential capacitive readout. / Brookhuis, Robert Anton; Sanders, Remco G.P.; Sikkens, Boudewijn N.A. et al.
29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016. Piscataway, NJ, USA: IEEE, 2016. p. 885-888.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Three-axis force-torque sensor with fully differential capacitive readout

AU - Brookhuis, Robert Anton

AU - Sanders, Remco G.P.

AU - Sikkens, Boudewijn N.A.

AU - Wiegerink, Remco J.

N1 - Conference code: 29

PY - 2016/1/24

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N2 - We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.

AB - We present a 3-axis force/torque sensor fabricated in a single SOI wafer. The sensor allows fully differential capacitive readout also for the normal force measurement, without the need for complicated lever mechanisms or wafer bonding. Fabrication is straightforward, with only two masks for deep reactive ion etching and one release etch. Furthermore, out-of-plane displacements are limited by the buried oxide layer thickness which allows for overload protection. The chip has a diameter of 5 mm, a normal force range of 1 N and a torque range from -4 to +4 Nmm and is designed for measuring the interaction forces involved in eye surgery.

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DO - 10.1109/MEMSYS.2016.7421772

M3 - Conference contribution

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EP - 888

BT - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016

PB - IEEE

CY - Piscataway, NJ, USA

T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016

Y2 - 24 January 2016 through 28 January 2016

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