Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology

Theo A. Frieswijk, Wim L.C. Rutten

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    Abstract

    A three-dimensional array of microelectrodes for use in intraneural stimulation and recording is presented. The 128 electrodes are at the tips of silicon needles, which are electrically insulated from each other. The needles in the array have differing heights, resulting in a true three-dimensional electrode structure. The distance between the needles is 120 μm, while the heights are 600, 425 and 250 μm. An overview of the technology for the realization of the device is given, and the contacting of the array is discussed. The array is connected to a gate array (containing multiplexing electronics, current sources and buffer amplifiers) through controlled collapse chip connections
    Original languageEnglish
    Title of host publication16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society 1994
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages808-809
    ISBN (Print)0-7803-2050-6
    DOIs
    Publication statusPublished - 3 Nov 1994
    Event16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1994 - Baltimore, United States
    Duration: 3 Nov 19946 Nov 1994
    Conference number: 16

    Conference

    Conference16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1994
    Abbreviated titleEMBC
    CountryUnited States
    CityBaltimore
    Period3/11/946/11/94

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  • Cite this

    Frieswijk, T. A., & Rutten, W. L. C. (1994). Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology. In 16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society 1994 (pp. 808-809). Piscataway, NJ: IEEE. https://doi.org/10.1109/IEMBS.1994.415155