Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology

Theo A. Frieswijk; Wim L.C. Rutten

doi:10.1109/IEMBS.1994.415155

Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology

Theo A. Frieswijk, Wim L.C. Rutten

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

37 Downloads (Pure)

Abstract

A three-dimensional array of microelectrodes for use in intraneural stimulation and recording is presented. The 128 electrodes are at the tips of silicon needles, which are electrically insulated from each other. The needles in the array have differing heights, resulting in a true three-dimensional electrode structure. The distance between the needles is 120 μm, while the heights are 600, 425 and 250 μm. An overview of the technology for the realization of the device is given, and the contacting of the array is discussed. The array is connected to a gate array (containing multiplexing electronics, current sources and buffer amplifiers) through controlled collapse chip connections

Original language	English
Title of host publication	16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society 1994
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	808-809
ISBN (Print)	0-7803-2050-6
DOIs	https://doi.org/10.1109/IEMBS.1994.415155
Publication status	Published - 3 Nov 1994
Event	16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1994 - Baltimore, United States Duration: 3 Nov 1994 → 6 Nov 1994 Conference number: 16

Conference

Conference	16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1994
Abbreviated title	EMBC
Country	United States
City	Baltimore
Period	3/11/94 → 6/11/94

Access to Document

10.1109/IEMBS.1994.415155

Frieswijk1994three
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title = "Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology",

abstract = "A three-dimensional array of microelectrodes for use in intraneural stimulation and recording is presented. The 128 electrodes are at the tips of silicon needles, which are electrically insulated from each other. The needles in the array have differing heights, resulting in a true three-dimensional electrode structure. The distance between the needles is 120 μm, while the heights are 600, 425 and 250 μm. An overview of the technology for the realization of the device is given, and the contacting of the array is discussed. The array is connected to a gate array (containing multiplexing electronics, current sources and buffer amplifiers) through controlled collapse chip connections",

author = "Frieswijk, {Theo A.} and Rutten, {Wim L.C.}",

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Frieswijk, TA & Rutten, WLC 1994, Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology. in 16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society 1994. IEEE, Piscataway, NJ, pp. 808-809, 16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1994, Baltimore, United States, 3/11/94. https://doi.org/10.1109/IEMBS.1994.415155

Three-dimensional neuroelectronic interface for peripheral nerve stimulation and recording: realization steps and contacting technology. / Frieswijk, Theo A.; Rutten, Wim L.C.

16th Annual International Conference of the IEEE Engineering in Medicine and Biology Society 1994. Piscataway, NJ : IEEE, 1994. p. 808-809.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - A three-dimensional array of microelectrodes for use in intraneural stimulation and recording is presented. The 128 electrodes are at the tips of silicon needles, which are electrically insulated from each other. The needles in the array have differing heights, resulting in a true three-dimensional electrode structure. The distance between the needles is 120 μm, while the heights are 600, 425 and 250 μm. An overview of the technology for the realization of the device is given, and the contacting of the array is discussed. The array is connected to a gate array (containing multiplexing electronics, current sources and buffer amplifiers) through controlled collapse chip connections

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