Time dependency of the planarization process in copper chemical mechanical polishing

V. Nguyen Hoang, B.H. Timmer, H. van Kranenburg, P.H. Woerlee

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    1 Citation (Scopus)
    36 Downloads (Pure)
    Original languageEnglish
    Title of host publicationProceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999
    PublisherIEEE
    Pages260-263
    Number of pages4
    ISBN (Print)2-86332-245-1
    Publication statusPublished - 13 Sep 1999
    Event29th European Solid-State Device Research Conference, ESSDERC 1999 - Leuven, Belgium
    Duration: 13 Sep 199915 Sep 1999
    Conference number: 29

    Publication series

    Name
    PublisherIEEE
    Volume1

    Conference

    Conference29th European Solid-State Device Research Conference, ESSDERC 1999
    Abbreviated titleESSDERC
    CountryBelgium
    CityLeuven
    Period13/09/9915/09/99

    Keywords

    • METIS-113903
    • IR-17018

    Cite this

    Nguyen Hoang, V., Timmer, B. H., van Kranenburg, H., & Woerlee, P. H. (1999). Time dependency of the planarization process in copper chemical mechanical polishing. In Proceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999 (pp. 260-263). IEEE.