Time dependency of the planarization process in copper chemical mechanical polishing

V. Nguyen Hoang; B.H. Timmer; H. van Kranenburg; P.H. Woerlee

Time dependency of the planarization process in copper chemical mechanical polishing

V. Nguyen Hoang, B.H. Timmer, H. van Kranenburg, P.H. Woerlee

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Original language	English
Title of host publication	Proceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999
Publisher	IEEE
Pages	260-263
Number of pages	4
ISBN (Print)	2-86332-245-1
Publication status	Published - 13 Sept 1999
Event	29th European Solid-State Device Research Conference, ESSDERC 1999 - Leuven, Belgium Duration: 13 Sept 1999 → 15 Sept 1999 Conference number: 29

Publication series

Name
Publisher	IEEE
Volume	1

Conference

Conference	29th European Solid-State Device Research Conference, ESSDERC 1999
Abbreviated title	ESSDERC
Country/Territory	Belgium
City	Leuven
Period	13/09/99 → 15/09/99

Keywords

METIS-113903
IR-17018

Access to Document

01505489

http://ieeexplore.ieee.org/document/1505489/

Cite this

@inproceedings{96ab33316a8942e88794354d5c5f39c5,

title = "Time dependency of the planarization process in copper chemical mechanical polishing",

keywords = "METIS-113903, IR-17018",

author = "{Nguyen Hoang}, V. and B.H. Timmer and {van Kranenburg}, H. and P.H. Woerlee",

year = "1999",

month = sep,

day = "13",

language = "English",

isbn = "2-86332-245-1",

publisher = "IEEE",

pages = "260--263",

booktitle = "Proceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999",

address = "United States",

note = "29th European Solid-State Device Research Conference, ESSDERC 1999, ESSDERC ; Conference date: 13-09-1999 Through 15-09-1999",

}

Nguyen Hoang, V, Timmer, BH, van Kranenburg, H & Woerlee, PH 1999, Time dependency of the planarization process in copper chemical mechanical polishing. in Proceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999. IEEE, pp. 260-263, 29th European Solid-State Device Research Conference, ESSDERC 1999, Leuven, Belgium, 13/09/99. <http://ieeexplore.ieee.org/document/1505489/>

Time dependency of the planarization process in copper chemical mechanical polishing. / Nguyen Hoang, V.; Timmer, B.H.; van Kranenburg, H. et al.
Proceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999. IEEE, 1999. p. 260-263.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Time dependency of the planarization process in copper chemical mechanical polishing

AU - Nguyen Hoang, V.

AU - Timmer, B.H.

AU - van Kranenburg, H.

AU - Woerlee, P.H.

N1 - Conference code: 29

PY - 1999/9/13

Y1 - 1999/9/13

KW - METIS-113903

KW - IR-17018

M3 - Conference contribution

SN - 2-86332-245-1

SP - 260

EP - 263

BT - Proceeding of the 29th European Solid-State Device Research Conference, ESSDERC 1999

PB - IEEE

T2 - 29th European Solid-State Device Research Conference, ESSDERC 1999

Y2 - 13 September 1999 through 15 September 1999

ER -