TriPleX tm platform technology for photonic integration: applications from UV through NIR to IR

Arne Leinse, Rene Heideman, E.J. Klein, R. Dekker, C.G.H. Roeloffzen, D.A.I. Marpaung

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    17 Citations (Scopus)
    2 Downloads (Pure)


    echnology [1] of LioniX has been further developed and has become one of the three main integrated optical platforms (besides InP and SOI) in the Netherlands [2]. TriPleXTM structures are realized with CMOS compatible fabrication equipment and the materials used are based on chemical endproducts of LPCVD processes, resulting in very reproducible material properties, allowing design by geometry. The basic concept of a TriPleXTM waveguide consists of a multilayer stack of stochiometric silicon nitride and silicon oxide. These materials have and opposite stress when deposited on a silicon wafer (nitride is tensile and oxide is compressive) and stacking them in a multilayer results in a macroscopically low stress layer stack.
    Original languageUndefined
    Title of host publication2011 ICO International Conference on Information Photonics (IP2011)
    Place of PublicationUSA
    PublisherIEEE Antennas & Propagation Society
    Number of pages2
    ISBN (Print)978-1-61284-315-5
    Publication statusPublished - 19 May 2011
    Event2011 ICO International Conference on Information Photonics, IP 2011 - Ottawa, Canada
    Duration: 18 May 201120 May 2011

    Publication series

    PublisherIEEE Antennas & Propagation Society


    Conference2011 ICO International Conference on Information Photonics, IP 2011
    Abbreviated titleIP


    • METIS-279179
    • EWI-20512
    • IR-78056

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