Understanding thermal interface conditions of chip-on-board LED light sources

Wessel W. Wits*, Daniel Jeggels, Yannick Jeggels, Norbert Engelberts

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

Thermal management of electronics devices is crucial for (lifetime) performance and reliability. As LED-based light sources are rapidly gaining market share, so is the need to understand their thermal behaviour. This paper analyses thermal interface conditions of a chip-on-board LED light source mounted onto a forced convection heat sink. A stepwise strategy is developed to characterize the heat sink and construct an experimentally validated computational model through which the actual efficiency and power (heat) losses of the light source are determined. Using this reference model, a high-resolution model is developed. Both ideal and poor interface conditions are simulated, and the observational quality of the chip's case temperature measurement point is discussed. Results show that only monitoring the temperature here cannot guarantee that overheating is avoided unless additional design margin or chip assembly validation is considered. Finally, the high-resolution model is also used to analyse the impact of production process variability.

Original languageEnglish
Title of host publication2020 26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020 - Proceedings
PublisherIEEE
ISBN (Electronic)9781728176437
DOIs
Publication statusPublished - 14 Sep 2020
Externally publishedYes
Event26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020 - Virtual, Berlin, Germany
Duration: 14 Sep 20209 Oct 2020
Conference number: 26

Conference

Conference26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020
Abbreviated titleTHERMINIC 2020
CountryGermany
CityVirtual, Berlin
Period14/09/209/10/20

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