Utilizing additive manufacturing to enhance two-phase heat transfer devices

Steffan Winkelhorst; Davoud Jafari; Wessel W. Wits

doi:10.1109/THERMINIC52472.2021.9626473

Utilizing additive manufacturing to enhance two-phase heat transfer devices

Steffan Winkelhorst, Davoud Jafari, Wessel W. Wits

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

214 Downloads (Pure)

Abstract

Two-phase heat transfer devices are among the most popular devices in thermal management systems due to their superior thermal characteristics. This paper investigates a thermosyphon for electronics cooling applications into which a freeform wick structure is inserted to enhance thermal performance. Additive manufacturing is employed to fabricate the wick structure tailored to the thermosyphon at hand using a conductive thermoplastic material. The goal of this study is to investigate how the freeform wick structure inserted into a thermosyphon affects the local liquid and vapor distributions and thus improving the thermal performance. Experiments were carried out with various heat loads and inclination angles, while the temperature distribution was recorded along the length of the thermosyphon. Thermal resistances were determined for both a conventional thermosyphon and an adapted version with an inserted wick structure in order to quantify the enhancement. The obtained experimental data demonstrate that the additively manufactured wick structure gives benefits at higher heat loads due to enhanced evaporation and boiling modes. The evaporation thermal resistance improves by 7% to 13% at heat loads above 55 W for the vertical orientation. Likewise, an improvement of about 7% to 9% was found at a heat load of 105 W for inclination angles of 30° and 60°. Both results exemplify the advantages additive manufacturing may bring to thermal management systems and in particular to two-phase heat transfer devices.

Original language	English
Title of host publication	2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Pages	1-6
ISBN (Electronic)	978-1-6654-1896-6
DOIs	https://doi.org/10.1109/THERMINIC52472.2021.9626473
Publication status	Published - 1 Dec 2021
Event	27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021 - Online Duration: 23 Sept 2021 → 23 Sept 2021 Conference number: 27 https://therminic2021.eu/

Publication series

Name	International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Publisher	IEEE
Volume	2021
ISSN (Print)	2474-1515
ISSN (Electronic)	2474-1523

Workshop

Workshop	27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021
Abbreviated title	THERMINIC 2021
Period	23/09/21 → 23/09/21
Internet address	https://therminic2021.eu/

Keywords

2022 OA procedure

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/THERMINIC52472.2021.9626473

Winkelhorst2021utilizingFinal published version, 1.13 MBLicence: Taverne

Cite this

Winkelhorst, S., Jafari, D., & Wits, W. W. (2021). Utilizing additive manufacturing to enhance two-phase heat transfer devices. In 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-6). (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC); Vol. 2021). https://doi.org/10.1109/THERMINIC52472.2021.9626473

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abstract = "Two-phase heat transfer devices are among the most popular devices in thermal management systems due to their superior thermal characteristics. This paper investigates a thermosyphon for electronics cooling applications into which a freeform wick structure is inserted to enhance thermal performance. Additive manufacturing is employed to fabricate the wick structure tailored to the thermosyphon at hand using a conductive thermoplastic material. The goal of this study is to investigate how the freeform wick structure inserted into a thermosyphon affects the local liquid and vapor distributions and thus improving the thermal performance. Experiments were carried out with various heat loads and inclination angles, while the temperature distribution was recorded along the length of the thermosyphon. Thermal resistances were determined for both a conventional thermosyphon and an adapted version with an inserted wick structure in order to quantify the enhancement. The obtained experimental data demonstrate that the additively manufactured wick structure gives benefits at higher heat loads due to enhanced evaporation and boiling modes. The evaporation thermal resistance improves by 7% to 13% at heat loads above 55 W for the vertical orientation. Likewise, an improvement of about 7% to 9% was found at a heat load of 105 W for inclination angles of 30° and 60°. Both results exemplify the advantages additive manufacturing may bring to thermal management systems and in particular to two-phase heat transfer devices.",

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Winkelhorst, S, Jafari, D & Wits, WW 2021, Utilizing additive manufacturing to enhance two-phase heat transfer devices. in 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), vol. 2021, pp. 1-6, 27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021, 23/09/21. https://doi.org/10.1109/THERMINIC52472.2021.9626473

Utilizing additive manufacturing to enhance two-phase heat transfer devices. / Winkelhorst, Steffan; Jafari, Davoud ; Wits, Wessel W.
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). 2021. p. 1-6 (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC); Vol. 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Jafari, Davoud

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N2 - Two-phase heat transfer devices are among the most popular devices in thermal management systems due to their superior thermal characteristics. This paper investigates a thermosyphon for electronics cooling applications into which a freeform wick structure is inserted to enhance thermal performance. Additive manufacturing is employed to fabricate the wick structure tailored to the thermosyphon at hand using a conductive thermoplastic material. The goal of this study is to investigate how the freeform wick structure inserted into a thermosyphon affects the local liquid and vapor distributions and thus improving the thermal performance. Experiments were carried out with various heat loads and inclination angles, while the temperature distribution was recorded along the length of the thermosyphon. Thermal resistances were determined for both a conventional thermosyphon and an adapted version with an inserted wick structure in order to quantify the enhancement. The obtained experimental data demonstrate that the additively manufactured wick structure gives benefits at higher heat loads due to enhanced evaporation and boiling modes. The evaporation thermal resistance improves by 7% to 13% at heat loads above 55 W for the vertical orientation. Likewise, an improvement of about 7% to 9% was found at a heat load of 105 W for inclination angles of 30° and 60°. Both results exemplify the advantages additive manufacturing may bring to thermal management systems and in particular to two-phase heat transfer devices.

AB - Two-phase heat transfer devices are among the most popular devices in thermal management systems due to their superior thermal characteristics. This paper investigates a thermosyphon for electronics cooling applications into which a freeform wick structure is inserted to enhance thermal performance. Additive manufacturing is employed to fabricate the wick structure tailored to the thermosyphon at hand using a conductive thermoplastic material. The goal of this study is to investigate how the freeform wick structure inserted into a thermosyphon affects the local liquid and vapor distributions and thus improving the thermal performance. Experiments were carried out with various heat loads and inclination angles, while the temperature distribution was recorded along the length of the thermosyphon. Thermal resistances were determined for both a conventional thermosyphon and an adapted version with an inserted wick structure in order to quantify the enhancement. The obtained experimental data demonstrate that the additively manufactured wick structure gives benefits at higher heat loads due to enhanced evaporation and boiling modes. The evaporation thermal resistance improves by 7% to 13% at heat loads above 55 W for the vertical orientation. Likewise, an improvement of about 7% to 9% was found at a heat load of 105 W for inclination angles of 30° and 60°. Both results exemplify the advantages additive manufacturing may bring to thermal management systems and in particular to two-phase heat transfer devices.

KW - 2022 OA procedure

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DO - 10.1109/THERMINIC52472.2021.9626473

M3 - Conference contribution

SN - 978-1-6654-1897-3

T3 - International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

SP - 1

EP - 6

BT - 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

T2 - 27th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2021

Y2 - 23 September 2021 through 23 September 2021

ER -

Utilizing additive manufacturing to enhance two-phase heat transfer devices

Abstract

Publication series

Workshop

Keywords

UN SDGs

Access to Document

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Cite this