Velocity sources as an explanation for experimentally observed variations in Si{111} etch rates

A.J. Nijdam, Johan W. Berenschot, J. van Suchtelen, Johannes G.E. Gardeniers, Michael Curt Elwenspoek

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In anisotropic wet-chemical etching of silicon the etch rate ratio of [Left Angle Bracket] 100 [Right Angle Bracket] to [Left Angle Bracket] 111 [Right Angle Bracket] orientations is an important parameter that determines the reproducibility and accuracy of microstructures. Up to now, it is not understood why the values found in the literature of this parameter are inconsistent. We think that this can be explained by boundary features, that we have called velocity sources, locations where the etch rate is increased as a consequence of mechanical or kinetic boundary conditions.
Original languageUndefined
Pages (from-to)135-138
Number of pages4
JournalJournal of micromechanics and microengineering
Issue number9
Publication statusPublished - Jun 1999


  • METIS-111684
  • IR-14584
  • EWI-13218

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