Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating

Kodai Hatakeyama, Edin Sarajlic, Martin Herman Siekman, L. Jalabert, H. Fujita, Niels Roelof Tas, Leon Abelmann

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)
3 Downloads (Pure)


Scanning Thermal Microscopy (SThM) and micro-thermal analysis allow the study of thermal phenomena at micro- and nanoscale. We present a novel scanning resistive probe aimed for thermal imaging and localized thermal analysis. The probe features an AFM cantilever with a sharp pyramidal tip. Metal nanowires are integrated at the inner edges of the pyramidal tip forming an electrical cross-junction at the apex. The nanometer- sized cross-junction, addressable through microelectrodes, can be utilized both as a local temperature sensor and a heater. We have fabricated a first prototype of the probe with a 150 um long, 36 um wide and 0.5 um thick silicon nitride cantilever. Platinum nanowires, 300 nm wide and 100 nm thick, are successfully integrated using a wafer-scale fabrication process based on corner lithography. We have experimentally characterized electrical and thermal properties of the probe demonstrating its proper functioning.
Original languageUndefined
Title of host publication2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)
Place of PublicationUSA
PublisherThe Printing House, Inc.
Number of pages4
ISBN (Print)978-1-4799-3508-6
Publication statusPublished - 26 Jan 2014
Event27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, United States
Duration: 26 Jan 201430 Jan 2014
Conference number: 27

Publication series



Conference27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Abbreviated titleMEMS
Country/TerritoryUnited States
CitySan Francisco


  • EWI-24573
  • METIS-304021
  • IR-91346

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